参数资料
型号: MT45W1MW16BDGB-708 AT
厂商: Micron Technology Inc
文件页数: 30/59页
文件大小: 0K
描述: IC PSRAM 16MBIT 104MHZ 54VFBGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: PSRAM(页)
存储容量: 16M (1M x 16)
速度: 70ns
接口: 并联
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 105°C
封装/外壳: 54-VFBGA
供应商设备封装: 54-VFBGA(6x8)
包装: 托盘
16Mb: 1 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
Electrical Characteristics
Table 8:
Electrical Characteristics and Operating Conditions
Wireless temperature 1 (–30oC < T C < +85oC); Industrial temperature (–40oC < T C < +85oC)
Description
Supply voltage
I/O supply voltage
Input high voltage
Input low voltage
Conditions
V CC
V CC Q
V IH
V IL
Symbol
Min
1.7
1.7
1.4
–0.2
Max
1.95
3.6
V CC Q + 0.2
0.4
Units
V
V
V
V
Notes
1
2, 3
4
Output high voltage
Output low voltage
Input leakage current
Output leakage current
I OH = –0.2mA
I OL = +0.2mA
V IN = 0 to V CC Q
OE# = V IH or
V OH
V OL
I LI
I LO
0.8 V CC Q
0.2 V CC Q
1
1
V
V
μA
μA
5
5
Chip disabled
Operating Current
Asynchronous random READ/
V IN = V CC Q or 0V
I CC 1
–70
20
mA
6
WRITE
Chip enabled,
Asynchronous page READ
Initial access, burst READ/WRITE
I OUT = 0
I CC 1P
I CC 2
–70
104 MHz
15
35
mA
mA
6
6
80 MHz
30
Continuous burst READ
I CC 3R
104 MHz
28
mA
6
80 MHz
22
Continuous burst WRITE
I CC 3W
104 MHz
33
mA
6
80 MHz
25
Standby current
V IN = V CC Q or 0V
I SB
Standard
70
μA
7
CE# = V CC Q
Notes:
1.
2.
3.
4.
5.
6.
–30°C and 3.6V I/O exceed the CellularRAM Workgroup 1.0 specifications.
Input signals may overshoot to V CC Q + 1.0V for periods less than 2ns during transitions.
V IH (MIN) value is not aligned with CellularRAM work group 1.0 specification of V CC Q - 0.4V.
Input signals may undershoot to V SS - 1.0V for periods less than 2ns during transitions.
BCR[5] = 0b.
This parameter is specified with the outputs disabled to avoid external loading effects. The
user must add the current required to drive output capacitance expected in the actual sys-
tem.
7. I SB (MAX) values measured with PAR set to FULL ARRAY and TCR set to +85°C. In order to
achieve low standby current, all inputs must be driven to either V CC Q or V SS . I SB might be
slightly higher for up to 500ms after power-up, after changes to the PAR array partition, or
when entering standby mode.
PDF: 09005aef81cb58ed/Source: 09005aef81c7a667
16mb_burst_cr1_0_p23z_2.fm - Rev. H 4/08 EN
30
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2005 Micron Technology, Inc. All rights reserved.
相关PDF资料
PDF描述
MT48H32M16LFB4-75B IT:C IC SDRAM 512MB 54VFBGA
MT48H8M16LFB4-75 IT:K TR IC SDRAM 128MBIT 133MHZ 54VFBGA
MTC100-JA2-P34 CONTACT INSERT PIN
MX841BE IC CONVERTER WHITE LED 8-SOIC
MXHV9910BTR IC LED DRIVER HIGH BRIGHT 8-SOIC
相关代理商/技术参数
参数描述
MT45W1MW16BP23ZWC2 制造商:Micron Technology Inc 功能描述:1MX16 PSRAM DIE-COM 1.8V BURST PSEUDO STATIC 1.8V I/O - Bulk
MT45W1MW16PABA-70 WT 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:RAM 存储器类型:SDRAM 存储容量:256M(8Mx32) 速度:143MHz 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA(8x13) 包装:托盘 其它名称:Q2841869
MT45W1MW16PABA-70 WT TR 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:378 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:8M(1M x 8,512K x 16) 速度:110ns 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-CBGA 供应商设备封装:48-CBGA(7x7) 包装:托盘
MT45W1MW16PAFA-70 WT 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:RAM 存储器类型:SDRAM 存储容量:256M(8Mx32) 速度:143MHz 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA(8x13) 包装:托盘 其它名称:Q2841869
MT45W1MW16PAFA-70 WT TR 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:378 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:8M(1M x 8,512K x 16) 速度:110ns 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-CBGA 供应商设备封装:48-CBGA(7x7) 包装:托盘