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参数资料
| 型号： | MT45W1MW16BDGB-708 AT |
| 厂商： | Micron Technology Inc |
| 文件页数： | 5/59页 |
| 文件大小： | 0K |
| 描述： | IC PSRAM 16MBIT 104MHZ 54VFBGA |
| 标准包装： | 1,000 |
| 格式 - 存储器： | RAM |
| 存储器类型： | PSRAM（页） |
| 存储容量： | 16M (1M x 16) |
| 速度： | 70ns |
| 接口： | 并联 |
| 电源电压： | 1.7 V ~ 1.95 V |
| 工作温度： | -40°C ~ 105°C |
| 封装/外壳： | 54-VFBGA |
| 供应商设备封装： | 54-VFBGA（6x8） |
| 包装： | 托盘 |
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16Mb: 1 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
General Description
General Description
Micron ? CellularRAM? is a high-speed, CMOS PSRAM memory device developed for
low-power, portable applications. The MT45W1MW16BDGB is a 16Mb DRAM core
device organized as 1 Meg x 16 bits. This device includes an industry-standard
burst mode Flash interface that dramatically increases read/write bandwidth compared
with other low-power SRAM or Pseudo SRAM offerings.
For seamless operation on a burst Flash bus, CellularRAM products incorporate a trans-
parent self-refresh mechanism. The hidden refresh requires no additional support from
the system memory controller and has no significant impact on device read/write
performance.
Two user-accessible control registers define device operation. The bus configuration
register (BCR) defines how the CellularRAM device interacts with the system memory
bus and is nearly identical to its counterpart on burst mode Flash devices. The refresh
configuration register (RCR) is used to control how refresh is performed on the DRAM
array. These registers are automatically loaded with default settings during power-up
and can be updated anytime during normal operation.
Special attention has been focused on standby current consumption during self refresh.
CellularRAM products include three system-accessible mechanisms to minimize
standby current. Partial-array refresh (PAR) limits refresh to only that part of the DRAM
array that contains essential data. Temperature-compensated refresh (TCR) uses an on-
chip sensor to adjust the refresh rate to match the device temperature. The refresh rate
decreases at lower temperatures to minimize current consumption during standby. TCR
can also be set by the system for maximum device temperatures of +85°C, +45°C, and
+15°C. Deep power-down (DPD) halts the REFRESH operation altogether and is used
when no vital information is stored in the device. These three refresh mechanisms are
accessed through the RCR.
PDF: 09005aef81cb58ed/Source: 09005aef81c7a667
16mb_burst_cr1_0_p23z_2.fm - Rev. H 4/08 EN
5
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2005 Micron Technology, Inc. All rights reserved.
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| MT45W1MW16BP23ZWC2 | 制造商:Micron Technology Inc 功能描述:1MX16 PSRAM DIE-COM 1.8V BURST PSEUDO STATIC 1.8V I/O - Bulk |
| MT45W1MW16PABA-70 WT | 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:RAM 存储器类型:SDRAM 存储容量:256M（8Mx32） 速度:143MHz 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:托盘 其它名称:Q2841869 |
| MT45W1MW16PABA-70 WT TR | 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:378 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:8M（1M x 8，512K x 16） 速度:110ns 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-CBGA 供应商设备封装:48-CBGA（7x7） 包装:托盘 |
| MT45W1MW16PAFA-70 WT | 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:RAM 存储器类型:SDRAM 存储容量:256M（8Mx32） 速度:143MHz 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:托盘 其它名称:Q2841869 |
| MT45W1MW16PAFA-70 WT TR | 功能描述:IC PSRAM 16MBIT 70NS 48VFBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:378 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:8M（1M x 8，512K x 16） 速度:110ns 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-CBGA 供应商设备封装:48-CBGA（7x7） 包装:托盘 |
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