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| 型号： | NOIH2SM1000S-HHC |
| 厂商： | ON Semiconductor |
| 文件页数： | 1/67页 |
| 文件大小： | 0K |
| 描述： | IC SPACE IMAGE SENSOR 84-JLCC |
| 标准包装： | 1 |
| 系列： | HAS2 |
| 象素大小： | 18µm x 18µm |
| 有源象素阵列： | 1024H x 1024V |
| 电源电压： | 3.3V |
| 类型： | CMOS 成像 |
| 封装/外壳： | * |
| 供应商设备封装： | * |
| 包装： | * |
| 其它名称： | CYIH1SM1000AA-HHCS CYIH1SM1000AA-HHCS-ND |
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NOIH2SM1000A
HAS2 Image Sensor
INTRODUCTION
Scope
This ICD version is generated after qualification
campaign closure. This specification details the ratings,
physical, geometrical, electrical and electro-optical
characteristics, and test- and inspection-data for the High
Accuracy Star Tracker (HAS2) CMOS active pixel image
sensor (CMOS APS).
The device described in this document is protected by US
patent 6,225,670 and others.
Component Type Values
Table 10 on page 9 provides a summary of the type
variants of the basic CMOS image sensor. The complete list
of specifications for each type variant is given in Detailed
Specifications on page 10.
All specifications in Detailed Specifications on page 10
are given at 25 ± 3 ° C, under nominal clocking and bias
conditions. Exceptions are noted in the ‘Remarks’ field.
Maximum Rating
Table 11 on page 9 specifies the maximum ratings. Do
not exceed these ratings at any times, during use or storage.
Physical Dimension and Geometrical Information
Figure 4 on page 25 shows the physical dimensions of the
assembled component. The geometrical information in
Figure 3 on page 10 describes the position of the die in the
package.
Pin Assignment
Figure 5 on page 26 contains the pin assignment. The
figure contains a schematic drawing and a pin list. A detailed
functional description of each pin is available in Pin List on
page 36.
Soldering Instructions
Soldering is restricted to manual soldering only. No wave
or reflow soldering is allowed. For manual soldering, the
following restrictions are applicable:
? Solder 1 pin on each of the four sides of the sensor.
? Cool down for a minimum period of 1 minute before
soldering another pin on each of the four sides.
? Repeat soldering of 1 pin on each side, including a 1
minute cool down period.
Handling Precautions
The component is susceptible to damage by electro-static
discharge. Therefore, use suitable precautions for protection
during all phases of manufacture, testing, packaging,
shipment, and any handling. Follow these guidelines:
http://onsemi.com
? Always manipulate devices in an ESD controlled
environment.
? Always store the devices in a shielded environment that
protects against ESD damage (at least a non-ESD
generating tray and a metal bag).
? Always wear a wrist strap when handling the devices
and use ESD safe gloves.
? The HAS2 is classified as class 1A (JEDEC
classification - [AD03]) device for ESD sensitivity.
For proper handling and storage conditions, refer to the
ON Semiconductor application note AN52561.
Limited Warranty
ON Semiconductor ’s Image Sensor Business Unit
warrants that the image sensor products to be delivered
hereunder, if properly used and serviced, will conform to
Seller ’s published specifications and will be free from
defects in material and workmanship for two (2) years
following the date of shipment. If a defect were to manifest
itself within two (2) years period from the sale date,
ON Semiconductor will either replace the product or give
credit for the product.
Return Material Authorization (RMA)
ON Semiconductor packages its image sensor products in
a clean room environment under strict handling procedures
and ships all image sensor products in ESD-safe,
clean-room-approved shipping containers. Products
returned to ON Semiconductor for failure analysis should be
handled under these same conditions and packed in its
original packing materials, or the customer may be liable for
the product.
Storage Information
The components must be stored in a dust-free and
temperature-, humidity-and ESD-controlled environment.
? Store devices in special ESD-safe trays such that the
glass window is never touched.
? Close the trays with EDS-safe rubber bands.
? Seal the trays in an ESD-safe conductive foil in clean
room conditions.
? For transport and storage outside a clean room, pack the
trays in a second ESD-save bag that is sealed in clean
room.
? Semiconductor Components Industries, LLC, 2013
May, 2013 ? Rev. 13
1
Publication Order Number:
NOIH2SM1000A/D
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