- 您现在的位置：买卖IC网 > PDF目录199494 > TSPC106AVGS66CG (E2V TECHNOLOGIES PLC) PCI BUS CONTROLLER, CBGA303 PDF资料下载
参数资料
| 型号： | TSPC106AVGS66CG |
| 厂商： | E2V TECHNOLOGIES PLC |
| 元件分类： | 总线控制器 |
| 英文描述： | PCI BUS CONTROLLER, CBGA303 |
| 封装： | 21 X 25 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CICGA-303 |
| 文件页数： | 13/41页 |
| 文件大小： | 581K |
| 代理商： | TSPC106AVGS66CG |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页当前第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页
20
TSPC106A
2102C–HIREL–01/05
Detailed
Specifications
Scope
This drawing describes the specific requirements of the TSPC106 in compliance with
MIL-STD-883 class B or manufacturer’s standard screening.
Applicable Documents
Documents applicable to the information contained in this datasheet are:
1.
MIL-STD-883: Test Methods and Procedures for Electronics
2.
MIL-PRF-38535: General Specifications for Microcircuits
Requirements
General
The microcircuits are in accordance with the applicable documents and as specified
herein.
Design and Construction
Terminal Connections
The terminal connections are as shown in “Pin Description” on page 4.
Lead Material and Finish
Lead material and finish are as specified in “Package Mechanical Data” on page 37.
Package
The macrocircuits are packaged in 303-pin ceramic ball grid array packages.
The precise package drawings are described at the end of the specification. “CBGA
Absolute Maximum Ratings
Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and affect
reliability.
Notes:
1. Functional operating conditions are given in AC and DC electrical specifications.
Stresses beyond the absolute maximums listed may affect device reliability or cause
permanent damage to the device.
2. Caution: Input voltage must not be greater than the VDD supply voltage by more than
2.5V at all times including during power-on reset.
Thermal Characteristics
This section provides thermal management information for the C4/CBGA package.
Proper thermal control design is primarily dependent upon the system-level design.
The use of C4 die on CBGA interconnect technology offers significant reduction in both
the signal delay and the microelectronic packaging volume. Figure 5 shows the salient
features of the C4/CBGA interconnect technology. The C4 interconnection provides
both the electrical and the mechanical connections for the die to the ceramic substrate.
Table 11. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
VDD
Supply Voltage
-0.3
3.6
V
AVDD
PLL Supply Voltage
-0.3
3.6
V
IN
Input Voltage
-0.3
5.5
V
TSTG
Storage Temperature Range
-55
+150
°C
相关PDF资料 |
PDF描述 |
|---|---|
| TSPC106AMGSU66CG | PCI BUS CONTROLLER, CBGA303 |
| TSPC603RMAB/Q6LC | 32-BIT, 166 MHz, RISC PROCESSOR, CQFP240 |
| TSPC860MHVGB/Q40B | 32-BIT, 40 MHz, MICROPROCESSOR, CBGA357 |
| TSPC860MHMZPB/Q40B | 32-BIT, 40 MHz, MICROPROCESSOR, PBGA357 |
| TS(X)PC860MHMZPU40B | 32-BIT, 40 MHz, MICROPROCESSOR, PBGA357 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TSPC106AVGS83CE | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MEMORY CONTROLLER |
| TSPC106AVGS83CG | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MEMORY CONTROLLER |
| TSPC106AVGSU/T66CE | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MEMORY CONTROLLER |
| TSPC106AVGSU/T66CG | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MEMORY CONTROLLER |
| TSPC106AVGSU/T83CE | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MEMORY CONTROLLER |
发布紧急采购，3分钟左右您将得到回复。