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参数资料
| 型号： | A42MX24-3VQ100B |
| 厂商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 40MX and 42MX FPGA Families |
| 中文描述： | 40MX和42MX FPGA系列 |
| 文件页数： | 46/93页 |
| 文件大小： | 854K |
| 代理商： | A42MX24-3VQ100B |
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50
Data Device Corporation
www.ddc-web.com
BU-6474X/6484X/6486X
J-07/05-0
A15 /
CLK_SEL_1
A15 (MSB)
73
16-bit bi-directional address bus.
For 64K RAM versions, this signal is always configured as address line A15 (MSB).
Refer to the description for A11-A0 below.
For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as
address line A15.
For 4K RAM versions, if UPADDREN is connected to logic "0", this signal operates as
CLK_SEL_1. In this case, A15/CLK_SEL_1 and A14/CLK_SEL_0 are used to select
the Mark3 clock frequency, as follows:
CLK_SEL_1
CLK_SEL_0
Clock Frequency
0
10 MHz
0
1
20 MHz
1
0
12 MHz
1
16 MHz
A14 /
CLK_SEL_0
A14
80
For 64K RAM versions, this signal is always configured as address line A14. Refer to
the description of A11-A0 below.
For 4K RAM versions, if UPADDREN is connected to logic "1", this signal operates as
A14.
For 4K RAM versions, if UPADDREN is connected to logic "0", then this signal oper-
ates as CLK_SEL_0. In this case, CLK_SEL_1 and CLK_SEL_0 are used to select the
Mark3 clock frequency, as defined in the description for A15/CLK_SEL1 above.
TABLE 52. PROCESSOR ADDRESS BUS
SIGNAL NAME
DESCRIPTION
BU-6474XF/GX
BU-6484XF/GX
BU-64863F/GX
PIN
4K RAM
(BU-6474XF/GX
BU-6484XF/GX)
64K RAM
(BU-64863F/GX)
16-bit bi-directional data bus.This bus interfaces the host processor to the Mini-ACE Mark3's internal regis-
ters and internal RAM. In addition, in transparent mode, this bus allows data transfers to take place
between the internal protocol/memory management logic and up to 64K x 16 of external RAM. Most of the
time, the outputs for D15 through D0 are in the high impedance state. They drive outward in the buffered or
transparent mode when the host CPU reads the internal RAM or registers.
Also, in the transparent mode, D15-D0 will drive outward (towards the host) when the protocol/management
logic is accessing (either reading or writing) internal RAM, or writing to external RAM. In the transparent
mode, D15-D0 drives inward when the CPU writes internal registers or RAM, or when the protocol/memory
management logic reads external RAM.
D10
60
D9
57
D8
52
D7
53
D6
41
D5
49
D4
43
D3
48
D2
47
D1
42
D0 (LSB)
46
D15 (MSB)
59
D14
56
D13
54
D12
55
D11
58
TABLE 51. DATA BUS
SIGNAL NAME
DESCRIPTION
BU-6474XF/GX
BU-6484XF/GX
BU-64863F/GX
PIN
FLAT PACK AND GULL WING PACKAGES - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.)
相关PDF资料 |
PDF描述 |
|---|---|
| A42MX36-2PQ100B | 40MX and 42MX FPGA Families |
| A42MX36-2PQ100ES | 40MX and 42MX FPGA Families |
| A42MX36-2TQ100 | 40MX and 42MX FPGA Families |
| A42MX36-2TQ100A | 40MX and 42MX FPGA Families |
| A42MX36-2TQ100B | 40MX and 42MX FPGA Families |
相关代理商/技术参数 |
参数描述 |
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| A42MX24-FPL84 | 功能描述:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPLG84 | 功能描述:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQ160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQ208 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQG160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
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