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参数资料
| 型号： | A42MX24-3VQ100B |
| 厂商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 40MX and 42MX FPGA Families |
| 中文描述： | 40MX和42MX FPGA系列 |
| 文件页数： | 57/93页 |
| 文件大小： | 854K |
| 代理商： | A42MX24-3VQ100B |
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60
Data Device Corporation
www.ddc-web.com
BU-6474X/6484X/6486X
J-07/05-0
A15 /
CLK_SEL_1
A15 (MSB)
C10
16-bit bi-directional address bus.
For 64K RAM versions, this signal is always configured as address
line A15 (MSB). Refer to the description for A11-A0 below.
For 4K RAM versions, if UPADDREN is connected to logic "1", this
signal operates as address line A15.
For 4K RAM versions, if UPADDREN is connected to logic "0", this signal
operates as CLK_SEL_1. In this case, A15/CLK_SEL_1 and
A14/CLK_SEL_0 are used to select the Mark3 clock frequency, as follows:
CLK_SEL_1
CLK_SEL_0
Clock Frequency
0
10 MHz
0
1
20 MHz
1
0
12 MHz
1
16 MHz
TABLE 61. PROCESSOR ADDRESS BUS
SIGNAL NAME
DESCRIPTION
BU-64840B3
BU-64860B3
BALL
A11
A14 /
CLK_SEL_0
A14
A10
For 64K RAM versions, this signal is always configured as address
line A14. Refer to the description of A11-A0 below.
For 4K RAM versions, if UPADDREN is connected to logic "1", this
signal operates as A14.
For 4K RAM versions, if UPADDREN is connected to logic "0", then
this signal operates as CLK_SEL_0. In this case, CLK_SEL_1 and
CLK_SEL_0 are used to select the Mark3 clock frequency, as defined
in the description for A15/CLK_SEL1 above.
A7
A13 /
LOGIC “1”
A13
B10
For 64K RAM versions, this signal is always configured as address
line A13. Refer to the description for A11-A0 below.
For 4K RAM versions, if UPADDREN is connected to logic "1", this
signal operates as A13.
For 4K RAM versions, if UPADDREN is connected to logic "0", then
this signal MUST be connected to +3.3V-LOGIC (logic "1").
B10
A12 /
RTBOOT
A12
A9
For 64K RAM versions, this signal is always configured as address
line A12. Refer to the description for A11-A0 below.
For 4K RAM versions, if UPADDREN is connected to logic "1", this
signal operates as A12.
For 4K RAM versions, if UPADDREN is connected to logic "0", then
this signal functions as RTBOOT. If RTBOOT is connected to logic "0",
the Mark3 will initialize in RT mode with the Busy status word bit set
following power turn-on. If RTBOOT is hardwired to logic "1", the
Mark3 will initialize in either Idle mode (for an RT-only part), or in BC
mode (for a BC/RT/MT part).
A10
BU-64743B8
BU-64843B8
BU-64863B8
BALL
4K RAM
(BU-64743B8
BU-6484XBX)
64K RAM
(BU-6486XBX)
BALL GRID ARRAY PACKAGE - SIGNAL DESCRIPTIONS BY FUNCTIONAL GROUPS (CONT.)
相关PDF资料 |
PDF描述 |
|---|---|
| A42MX36-2PQ100B | 40MX and 42MX FPGA Families |
| A42MX36-2PQ100ES | 40MX and 42MX FPGA Families |
| A42MX36-2TQ100 | 40MX and 42MX FPGA Families |
| A42MX36-2TQ100A | 40MX and 42MX FPGA Families |
| A42MX36-2TQ100B | 40MX and 42MX FPGA Families |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A42MX24-FPL84 | 功能描述:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPLG84 | 功能描述:IC FPGA MX SGL CHIP 36K 84-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQ160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQ208 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQG160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
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