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参数资料
| 型号： | HSP50210JI-52Z |
| 厂商： | Intersil |
| 文件页数： | 51/51页 |
| 文件大小： | 0K |
| 描述： | IC DEMODULATOR COSTAS 84-PLCC |
| 标准包装： | 15 |
| 功能： | 解调器 |
| 频率： | 52MHz |
| RF 型： | AM，FM |
| 封装/外壳： | 84-LCC（J 形引线） |
| 包装： | 管件 |
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HSP50210
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
CL
0 .042 (1.07 )
0.056 (1.42)
0.050 (1.27) T P
0.004 (0.10)
0 .025 (0.64 )
0.045 (1.14)
C
R
N84.1.15 (JEDEC MS-018AF ISSUE A)
84 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A
A1
0.165
0.090
0.180
0.120
4.20
2.29
4.57
3.04
-
-
D2/E2
D
1.185
1.195
30.10
30.35
-
E1 E
CL
D2/E2
VIEW “A”
D1
D2
E
E1
1.150
0.541
1.185
1.150
1.158
0.569
1.195
1.158
29.21
13.75
30.10
29.21
29.41
14.45
30.35
29.41
3
4, 5
-
3
D1
D
A1
A
0.020 (0.51)
MIN
E2
N
0.541
84
0.569
13.75
84
14.45 4, 5
6
Rev. 2 11/97
-C- PLANE
0.020 (0.51) MAX
3 PLCS
0.026 (0.66)
0.032 (0.81)
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
SEATING
0.045 (1.14)
MIN
MIN
VIEW “A” TYP.
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane -C- contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
51
FN3652.5
July 2, 2008
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