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参数资料
| 型号： | HSP50214BVIZ |
| 厂商： | Intersil |
| 文件页数： | 62/62页 |
| 文件大小： | 0K |
| 描述： | IC DOWNCONVERTER 14BIT 120-MQFP |
| 标准包装： | 24 |
| 功能： | 降频器 |
| RF 型： | AMPS，CDMA，GSM，TDMA |
| 封装/外壳： | 120-BQFP |
| 包装： | 托盘 |
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HSP50214B
Metric Plastic Quad Flatpack Packages (MQFP/PQFP)
D
D1
Q120.28x28 (JEDEC MO-108DA-1 ISSUE A)
120 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
-D-
INCHES
MILLIMETERS
SYMBOL
A
A1
MIN
-
0.010
MAX
0.160
-
MIN
-
0.25
MAX
4.07
-
NOTES
-
-
E E1
-A-
-B-
e
A2
B
B1
D
D1
E
E1
L
0.125
0.012
0.012
1.219
1.098
1.219
1.098
0.026
0.144
0.018
0.016
1.238
1.106
1.238
1.106
0.037
3.17
0.30
0.30
30.95
27.90
30.95
27.90
0.65
3.67
0.45
0.40
31.45
28.10
31.45
28.10
0.95
-
6
-
3
4, 5
3
4, 5
-
PIN 1
N
e
120
0.032 BSC
120
0.80 BSC
7
-
-H-
A
SEATING
PLANE
NOTES:
Rev. 0 1/94
0.10
0.004
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
0.40
0.016 MIN
5 o -16 o
0.20
0.008
M
C A-B S
-C-
D S
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
0 o MIN
0 o -7 o
A2 A1
B
B1
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
L
5 o -16 o
0.13/0.17
0.005/0.007
BASE METAL
WITH PLATING
0.13/0.23
6. Dimension B does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total.
7. “N” is the number of terminal positions.
0.005/0.009
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
62
FN4450.4
May 1, 2007
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