参数资料
型号: IDT88P8341BHI
厂商: IDT, Integrated Device Technology Inc
文件页数: 94/96页
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
标准包装: 24
系列: *
其它名称: 88P8341BHI
94
IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
ACRONYM
MEANING
FIFO
First In First Out memory
LID
Logical IDentifier See also Logical Port (LP)
The entity associated with a flow of data between a SPI-3 LP to a SPI-4 LP, or a SPI-4 LP to a SPI-3 LP.
LP
Logical Port. See also Logical Identifier (LID)
The entity associated with a SPI-3 or SPI-4 address.
OIF
Optical Internetworking Forum
SPI-3
System Packet Interface Level 3
This interface is defined by the OIF implementation agreement OIF-SPI3-01.0 - SPI-3 Packet Interface for
Physical and Link Layers for OC-48 available at http://www.oiforum.com/public/impagreements.html
SPI-4
System Packet Interface Level 4 phase 2
This interface is defined by the OIF implementation agreement OIF-SPI4-02.1 - System Packet Interface
Level 4 (SPI-4) Phase 2: OC-192 System Interface for Physical and Link Layer Devices available
athttp://www.oiforum.com/public/impagreements.html
13. GLOSSARY
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IDT88P8342BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDT88P8344BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装