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参数资料
| 型号： | M393B5273CH0-CK0 |
| 元件分类： | DRAM |
| 英文描述： | 512M X 72 MULTI DEVICE DRAM MODULE, 0.225 ns, DMA240 |
| 封装： | HALOGEN FREE AND ROHS COMPLIANT, DIMM-240 |
| 文件页数： | 15/58页 |
| 文件大小： | 1982K |
| 代理商： | M393B5273CH0-CK0 |
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- 16 -
datasheet
DDR3 SDRAM
Rev. 1.0
Registered DIMM
11. Absolute Maximum Ratings
11.1 Absolute Maximum DC Ratings
NOTE :
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard.
3. VDD and VDDQ must be within 300mV of each other at all times;and VREF must be not greater than 0.6 x VDDQ, When VDD and VDDQ are less than 500mV; VREF may be
equal to or less than 300mV.
11.2 DRAM Component Operating Temperature Range
NOTE :
1. Operating Temperature TOPER is the case surface temperature on the center/top side of the DRAM. For measurement conditions, please refer to the JEDEC document
JESD51-2.
2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the DRAM case temperature must be main-
tained between 0-85
°C under all operating conditions
3. Some applications require operation of the Extended Temperature Range between 85
°C and 95°C case temperature. Full specifications are guaranteed in this range, but the
following additional conditions apply:
a) Refresh commands must be doubled in frequency, therefore reducing the refresh interval tREFI to 3.9us. It is also possible to specify a component with 1X refresh (tREFI
to 7.8us) in the Extended Temperature Range.
b) If Self-Refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual Self-Refresh mode with Extended Temperature
Range capability (MR2 A6 = 0b and MR2 A7 = 1b) or enable the optional Auto Self-Refresh mode (MR2 A6 = 1b and MR2 A7 = 0b)
12. AC & DC Operating Conditions
12.1 Recommended DC Operating Conditions (SSTL-15)
NOTE:
1. Under all conditions VDDQ must be less than or equal to VDD.
2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together.
Symbol
Parameter
Rating
Units
NOTE
VDD
Voltage on VDD pin relative to VSS
-0.4 V ~ 1.975 V
V
1,3
VDDQ
Voltage on VDDQ pin relative to VSS
-0.4 V ~ 1.975 V
V
1,3
VIN, VOUT
Voltage on any pin relative to VSS
-0.4 V ~ 1.975 V
V
1
TSTG
Storage Temperature
-55 to +100
°C
1, 2
Symbol
Parameter
rating
Unit
NOTE
TOPER
Operating Temperature Range
0 to 95
°C
1, 2, 3
Symbol
Parameter
Rating
Units
NOTE
Min.
Typ.
Max.
VDD
Supply Voltage
1.425
1.5
1.575
V
1,2
VDDQ
Supply Voltage for Output
1.425
1.5
1.575
V
1,2
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