参数资料
型号: MC68MH360VR33LR2
厂商: Freescale Semiconductor
文件页数: 148/158页
文件大小: 0K
描述: IC MPU QUICC 33MHZ 357-PBGA
标准包装: 180
系列: M683xx
处理器类型: M683xx 32-位
速度: 33MHz
电压: 5V
安装类型: 表面贴装
封装/外壳: 357-BBGA
供应商设备封装: 357-PBGA(25x25)
包装: 带卷 (TR)
Illustrations
ILLUSTRATIONS
Figure
Number
Title
Page
Number
1-1
QMC Channel Addressing Capability ............................................................................. 1-2
1-2
Ethernet-to-BRI Bridge Using MC68EN360................................................................... 1-6
1-3
Internal Routing for Ethernet-to-BRI Bridge Using MC68EN360.................................. 1-7
1-4
Ethernet-to-BRI Bridge Using MC68MH360 ................................................................. 1-8
1-5
Internal Routing for Ethernet-to-BRI Bridge Using MC68MH360 ................................ 1-8
1-6
Ethernet-to-PRI Bridge Using MPC860MH.................................................................... 1-9
1-7
Internal Routing for Ethernet-to-PRI Bridge Using MPC860 ......................................... 1-9
1-8
Frame Structures for E1/CEPT and T1 TDM Interfaces ............................................... 1-12
1-9
MC68MH360 Connection to a TDM Bus ..................................................................... 1-13
2-1
MC68MH360 and MPC860MH Internal Memory Structures......................................... 2-1
2-2
QMC Memory Structure .................................................................................................. 2-2
2-3
Time Slot Assignment Table ........................................................................................... 2-8
2-4
Time Slot Assignment Table for 64-Channel Common Rx and Tx Mapping............... 2-10
2-5
Rx Time Slot Assignment Table for 32 Channels over Two SCCs............................... 2-11
2-6
Time Slot Assignment Tables for 64 Channels over 2 SCCs ........................................ 2-13
2-7
CHAMR—Channel Mode Register (HDLC) ................................................................ 2-15
2-8
TSTATE—Tx Internal State (HDLC) ........................................................................... 2-17
2-9
INTMSK and Interrupt Table Entry (HDLC) ................................................................ 2-18
2-10
RSTATE—Rx Internal State (HDLC)........................................................................... 2-19
2-11
CHAMR—Channel Mode Register (Transparent Mode).............................................. 2-21
2-12
TSTATE—Tx Internal State (Transparent Mode)......................................................... 2-23
2-13
INTMSK and Interrupt Table Entry (Transparent Mode) ............................................. 2-24
2-14
Examples of Different T1 Time Slot Allocation............................................................ 2-27
2-15
RSTATE—Rx Internal State (Transparent Mode) ........................................................ 2-28
3-1
Command Register (CR).................................................................................................. 3-1
4-1
Circular Interrupt Table in External Memory .................................................................. 4-1
4-2
SCC Event Register ......................................................................................................... 4-4
4-3
SCCM Register ................................................................................................................ 4-5
4-4
Interrupt Table Entry........................................................................................................ 4-5
4-5
Channel Interrupt Flow .................................................................................................... 4-8
5-1
Receive Buffer Descriptor (RxBD) ................................................................................. 5-1
5-2
Nonoctet Alignment Data ................................................................................................ 5-4
5-3
Transmit Buffer Descriptor (TxBD) ................................................................................ 5-5
5-4
Relation between PAD and NOF..................................................................................... 5-6
5-5
MC68MH360 Internal Memory....................................................................................... 5-8
5-6
SCC2 Parameter RAM Overlap Example........................................................................ 5-8
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
相关PDF资料
PDF描述
MC68MH360VR25LR2 IC MPU QUICC 25MHZ 357-PBGA
MC68MH360VR25L IC MPU QUICC 25MHZ 357-PBGA
MC68MH360CVR25L IC MPU QUICC 25MHZ 357-PBGA
HMC40DTEI CONN EDGECARD 80POS .100 EYELET
FMC50DRAS-S734 CONN EDGECARD 100PS .100 R/A SLD
相关代理商/技术参数
参数描述
MC68MH360ZP25L 功能描述:IC MPU 32BIT QUICC 357-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:M683xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA(25x25) 包装:托盘
MC68MH360ZP25LR2 功能描述:IC MPU QUICC 25MHZ 357-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:M683xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA,FCBGA 供应商设备封装:783-FCPBGA(29x29) 包装:托盘
MC68MH360ZP25VL 功能描述:IC MPU QUICC ETHER 25MHZ 357PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:M683xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA(25x25) 包装:托盘
MC68MH360ZP33K 制造商:Freescale Semiconductor 功能描述:MULTI HDLC QUICC32 - Trays
MC68MH360ZP33L 功能描述:IC MPU 32BIT QUICC 357-PBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:M683xx 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA(25x25) 包装:托盘