参数资料
型号: MT48H8M16LFB4-75 IT:K TR
厂商: Micron Technology Inc
文件页数: 40/63页
文件大小: 0K
描述: IC SDRAM 128MBIT 133MHZ 54VFBGA
标准包装: 1
格式 - 存储器: RAM
存储器类型: 移动 SDRAM
存储容量: 128M(8Mx16)
速度: 133MHz
接口: 并联
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 54-VFBGA
供应商设备封装: 54-VFBGA(8x8)
包装: 标准包装
其它名称: 557-1530-6
128Mb: x16 Mobile SDRAM
Electrical Specifications
Table 12:
AC Functional Characteristics
Notes: 5, 6, 8, 9, 11; notes appear on page 42
Parameter
Symbol
-75
-8
Units
Notes
CCD
CKED
PED
DQD
READ/WRITE command to READ/WRITE command
CKE to clock disable or power-down entry mode
CKE to clock enable or power-down exit setup mode
DQM to input data delay
t
t
t
t
1
1
1
0
1
1
1
0
t
t
t
t
CK
CK
CK
CK
17
14
14
17
DQM to data mask during WRITEs
t DQM
0
0
t CK
17
DQM to data High-Z during READs
t
DQZ
2
2
t
CK
17
WRITE command to input data delay
t
DWD
0
0
t
CK
17
DAL
Data-in to ACTIVE command
t
5
5
t
CK
15, 21
Data-in to PRECHARGE command
t
DPL
2
2
t
CK
16, 21
Last data-in to burst STOP command
Last data-in to new READ/WRITE command
t
t
BDL
CDL
1
1
1
1
t
t
CK
CK
17
17
Last data-in to PRECHARGE command
LOAD MODE REGISTER command to ACTIVE or REFRESH
t RDL
t MRD
2
2
2
2
t CK
t CK
16, 21
command
Data-out to High-Z from PRECHARGE command
CL = 3
CL = 2
t ROH(3)
t ROH(2)
3
2
3
2
t CK
t CK
17
17
Table 13:
I DD Specifications and Conditions
Notes: 5, 6, 11, 13; notes appear on page 42; V DD = V DD Q = 1.7–1.95V
Max
Parameter/Condition
Operating current:
Symbol
I DD 1
-75
50
-8
50
Units
mA
Notes
3, 18, 19
Active mode; BL = 1; READ or WRITE; t RC = t RC (MIN)
Standby current:
I DD 2P
150
150
μA
26
Power-down mode; All banks idle; CKE = LOW
Standby current:
I DD 2N
10
10
mA
Non-power-down mode; All banks idle; CKE = HIGH
Standby current:
I DD 3P
5
5
mA
3, 12, 19
Power-down mode; CKE = LOW; CS# = HIGH; All banks active; No
accesses in progress
Standby current:
I DD 3N
40
35
mA
3, 12, 19
Non-power-down mode; CKE = HIGH; CS# = HIGH; All banks active
after t RCD met; No accesses in progress
Operating current:
I DD 4
50
50
mA
3, 18, 19
Burst mode; READ or WRITE; All banks active, half DQs toggling
every cycle
RFC = 15.625μs
Auto refresh current:
CKE = HIGH; CS# = HIGH
Deep power-down
t RFC = t RFC (MIN)
t
I DD 5
I DD 6
I ZZ
100
2
10
80
2
10
mA
mA
μA
3, 12, 18,
19, 25
26, 28
PDF: 09005aef8237e877/Source: 09005aef8237e8d8
128Mb_x16 Mobile SDRAM_Y25M_2.fm - Rev. C 2/07 EN
40
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2006 Micron Technology, Inc. All rights reserved.
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