参数资料
型号: MT48H8M16LFB4-75 IT:K TR
厂商: Micron Technology Inc
文件页数: 8/63页
文件大小: 0K
描述: IC SDRAM 128MBIT 133MHZ 54VFBGA
标准包装: 1
格式 - 存储器: RAM
存储器类型: 移动 SDRAM
存储容量: 128M(8Mx16)
速度: 133MHz
接口: 并联
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 54-VFBGA
供应商设备封装: 54-VFBGA(8x8)
包装: 标准包装
其它名称: 557-1530-6
128Mb: x16 Mobile SDRAM
Functional Description
Functional Description
In general, the 128Mb SDRAMs (2 Meg x 16 x 4 banks) are quad-bank DRAMs that
operate at 1.8V and include a synchronous interface (all signals are registered on the
positive edge of the clock signal, CLK). Each of the x16’s 33,554,432-bit banks is orga-
nized as 4,096 rows by 512 columns by 16 bits.
Read and write accesses to the SDRAM are burst oriented; accesses start at a selected
location and continue for a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an ACTIVE command, which is then
followed by a READ or WRITE command. The address bits registered coincident with the
ACTIVE command are used to select the bank and row to be accessed (BA0 and BA1
select the bank, A0–A11 select the row). The address bits (A0–A8) registered coincident
with the READ or WRITE command are used to select the starting column location for
the burst access.
Prior to normal operation, the SDRAM must be initialized. The following sections
provide detailed information covering device initialization, register definition,
command descriptions, and device operation.
Initialization
SDRAMs must be powered up and initialized in a predefined manner. Operational
procedures other than those specified may result in undefined operation. Power should
be applied to V DD and V DD Q simultaneously. Once the power is applied to V DD and
V DD Q, and the clock is stable (stable clock is defined as a signal cycling within timing
constraints specified for the clock pin), the SDRAM requires a 100μs delay prior to
issuing any command other than a COMMAND INHIBIT or NOP. Starting at some point
during this 100μs period and continuing at least through the end of this period,
COMMAND INHIBIT or NOP commands should be applied.
Once the 100μs delay has been satisfied with at least one COMMAND INHIBIT or NOP
command having been applied, a PRECHARGE command should be applied. All banks
must then be precharged, thereby placing the device in the all banks idle state.
Once in the idle state, two AUTO REFRESH cycles must be performed. After the AUTO
REFRESH cycles are complete, the SDRAM is ready for mode register programming.
Because the mode register will power up in an unknown state, it should be loaded prior
to applying any operational command.
Mode Register Definition
There are two mode registers in the mobile component, the mode register and the
extended mode register. The mode register is illustrated in Figure 4 on page 9 and the
extended mode register is illustrated in Figure 6 on page 12.
The mode register defines the specific mode of operation of the SDRAM, including BL,
burst type, CAS latency (CL), operating mode, and write burst mode. The mode register
is programmed via the LOAD MODE REGISTER command and will retain the stored
information until it is programmed again or the device loses power.
Mode register bits M0–M2 specify BL, M3 specifies the type of burst (sequential or inter-
leaved), M4–M6 specify the CL, M7 and M8 specify the operating mode, M9 specifies the
write burst mode, and M10, and M11 should be set to zero. M12 and M13 should be set
to zero to select the mode register.
PDF: 09005aef8237e877/Source: 09005aef8237e8d8
128Mb_x16 Mobile SDRAM_Y25M_2.fm - Rev. C 2/07 EN
8
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2006 Micron Technology, Inc. All rights reserved.
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MT48H8M16LFB4-8 制造商:Micron Technology Inc 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA
MT48H8M16LFB4-8 IT 制造商:Micron Technology Inc 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA
MT48H8M16LFB4-8 IT TR 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:96 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:16M(2M x 8,1M x 16) 速度:70ns 接口:并联 电源电压:2.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘