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参数资料
| 型号： | RK80532RC056128 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2400 MHz, MICROPROCESSOR, CPGA478 |
| 封装： | FLIP CHIP, PGA2-478 |
| 文件页数： | 81/99页 |
| 文件大小： | 4142K |
| 代理商： | RK80532RC056128 |
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82
Datasheet
Thermal Specifications and Design Considerations
6.1
Processor Thermal Specifications
The Celeron processor 0.13 micron process requires a thermal solution to maintain temperatures
within the operating limits as set forth in Section 6.1.1. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and potentially
other components in the system. As processor technology changes, thermal management becomes
increasingly crucial when building computer systems. Maintaining the proper thermal environment
is key to reliable, long-term system operation.
A complete thermal solution includes both component and system level thermal management
features. Component-level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to Intel Pentium 4
Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guide.
6.1.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains within the
minimum and maximum case temperature (TC) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 37. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, refer to the appropriate
processor thermal design guidelines.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in Table 37 instead of the maximum processor
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
unlikely event that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to Section 7.3. To ensure maximum flexibility
for future requirements, systems should be designed to the Flexible Motherboard (FMB)
guidelines, even if a processor with a lower thermal dissipation is currently planned. In all cases,
the Thermal Monitor feature must be enabled for the processor to remain within
specification.
Multiple VID processors will be shipped either at VID=1.475 V, VID=1.500 V, or VID=1.525 V.
Processors with multiple VIDs have TDP _max of the highest VID for the specified frequency. For
example, for the processors through 2.40 GHz, the TDP would be the one at VID=1.525 V of
57.1 W.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532RC060128S L6ZY | 制造商:Intel 功能描述:MPU Celeron? Processor 0.13um 2.5GHz 478-Pin FCPGA2 制造商:Intel 功能描述:NORTHWOOD; MPU CELERON 0.13UM 2.5GHZ 478PIN FCPGA2 - Trays |
| RK80532RC060128SL72B | 功能描述:IC CELERON 2.5GHZ 478FC-PGA2 RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532RC064128 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RK805346RE067256 | 制造商:Intel 功能描述:TRAY CELERON D 330 - Trays |
| RK80546KF0871M | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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