参数资料
型号: RK80532RC056128
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 2400 MHz, MICROPROCESSOR, CPGA478
封装: FLIP CHIP, PGA2-478
文件页数: 96/99页
文件大小: 4142K
代理商: RK80532RC056128
96
Datasheet
Boxed Processor Specifications
8.4
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution utilized by the boxed
processor.
8.4.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system and is
ultimately the responsibility of the system integrator. The processor temperature is specified in
Chapter 6.0. The boxed processor fan heatsink is able to keep the processor temperature within the
specifications (see Table 37) in chassis that provide good thermal management. For the boxed
processor fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink
is unimpeded. Airflow is into the center and out of the sides of the fan heatsink. Airspace is
required around the fan to ensure that the airflow through the fan heatsink is not blocked. Blocking
the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. Figure 43 and
Figure 44 illustrate an acceptable airspace clearance for the fan heatsink. The air temperature
entering the fan should be kept below 40 °C. Again, meeting the processor's temperature
specification is the responsibility of the system integrator.
Figure 43. Boxed Processor Fan Heatsink Airspace Keep-Out Requirements
(Side 1 View)
相关PDF资料
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RK80546KG0882MM 64-BIT, 3200 MHz, MICROPROCESSOR, CPGA604
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