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参数资料
| 型号： | RK80532RC056128 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2400 MHz, MICROPROCESSOR, CPGA478 |
| 封装： | FLIP CHIP, PGA2-478 |
| 文件页数： | 94/99页 |
| 文件大小： | 4142K |
| 代理商： | RK80532RC056128 |
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94
Datasheet
Boxed Processor Specifications
The level of bow or bend depends on the motherboard material properties and component layout.
Any additional board stiffening devices (like plates) are not necessary and should not be used along
with the reference mechanical components and boxed processor. Using such devices increases the
compressive load on the processor package and socket, likely beyond the maximum load that is
specified for those components. See the Pentium 4 Processor in the 478-pin Package in the
478-pin Package Thermal Design Guidelines for details on the Intel reference design.
Chassis that have adequate clearance between the motherboard and chassis wall (minimum
0.250 inch) should be selected to ensure that the board's underside bend does not contact the
chassis.
8.3
Electrical Requirements
8.3.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be
shipped with the boxed processor to draw power from a power header on the motherboard. The
power cable connector and pinout are shown in Figure 41. Motherboards must provide a matched
power header to support the boxed processor. Table 41 contains specifications for the input and
output signals at the fan heatsink connector. The fan heatsink outputs a SENSE signal, which is an
open-collector output that pulses at a rate of two pulses per fan revolution. A motherboard pull-up
resistor provides VOH to match the system board-mounted fan speed monitor requirements, if
applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the
connector should be tied to GND. Note: The motherboard must supply a constant +12V to the
processor’s power header to ensure proper operation of the variable speed fan for the boxed
processor.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the platform
documentation or on the system board itself. Figure 42 shows the location of the fan power
connector relative to the processor socket. The motherboard power header should be positioned
within 4.33 inches from the center of the processor socket.
Figure 41. Boxed Processor Fan Heatsink Power Cable Connector Description
Pin
Signal
Straight square pin, 3-pin terminal housing with
polarizing ribs and friction locking ramp.
0.100" pin pitch, 0.025" square pin width.
Waldom/Molex P/N 22-01-3037 or equivalent.
Match with straight pin, friction lock header on motherboard
Waldom/Molex P/N 22-23-2031, AMP P/N 640456-3,
or equivalent.
1
2
3
GND
+12 V
SENSE
12
3
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532RC060128S L6ZY | 制造商:Intel 功能描述:MPU Celeron? Processor 0.13um 2.5GHz 478-Pin FCPGA2 制造商:Intel 功能描述:NORTHWOOD; MPU CELERON 0.13UM 2.5GHZ 478PIN FCPGA2 - Trays |
| RK80532RC060128SL72B | 功能描述:IC CELERON 2.5GHZ 478FC-PGA2 RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532RC064128 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RK805346RE067256 | 制造商:Intel 功能描述:TRAY CELERON D 330 - Trays |
| RK80546KF0871M | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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