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| 型号： | RK80532RC056128 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2400 MHz, MICROPROCESSOR, CPGA478 |
| 封装： | FLIP CHIP, PGA2-478 |
| 文件页数： | 99/99页 |
| 文件大小： | 4142K |
| 代理商： | RK80532RC056128 |
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Datasheet
99
Debug Tools Specifications
9.0
Debug Tools Specifications
Refer to the ITP700 Debug Port Design Guide and the appropriate Platform Design Guide for
more detailed information regarding debug tools specifications.
9.1
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces (LAIs) for use
in debugging Celeron processor on 0.13 micron process systems. Tektronix and Agilent should be
contacted to get specific information about their logic analyzer interfaces. The following
information is general in nature. Specific information must be obtained from the logic analyzer
vendor.
Because of the complexity of Celeron processor on 0.13 micron process systems, the LAI is critical
in providing the ability to probe and capture system bus signals. There are two sets of
considerations to keep in mind when designing a Celeron processor on 0.13 micron process system
that can make use of an LAI: mechanical and electrical.
9.1.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI pins plug into the
socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the processor and a logic analyzer.
The maximum volume occupied by the LAI, known as the keep-out volume, as well as the cable
egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keep-out volume remains unobstructed inside the system. Note that it is possible
that the keep-out volume reserved for the LAI may differ from the space normally occupied by the
Celeron processor on 0.13 micron process heatsink. If this is the case, the logic analyzer vendor
will provide a cooling solution as part of the LAI.
9.1.2
Electrical Considerations
The LAI will also affect the electrical performance of the system bus; therefore, it is critical to
obtain electrical load models from each of the logic analyzer vendors to allow running system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532RC060128S L6ZY | 制造商:Intel 功能描述:MPU Celeron? Processor 0.13um 2.5GHz 478-Pin FCPGA2 制造商:Intel 功能描述:NORTHWOOD; MPU CELERON 0.13UM 2.5GHZ 478PIN FCPGA2 - Trays |
| RK80532RC060128SL72B | 功能描述:IC CELERON 2.5GHZ 478FC-PGA2 RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532RC064128 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RK805346RE067256 | 制造商:Intel 功能描述:TRAY CELERON D 330 - Trays |
| RK80546KF0871M | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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