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| 型号： | RK80532RC056128 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2400 MHz, MICROPROCESSOR, CPGA478 |
| 封装： | FLIP CHIP, PGA2-478 |
| 文件页数： | 90/99页 |
| 文件大小： | 4142K |
| 代理商： | RK80532RC056128 |
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90
Datasheet
Features
7.3.1
Thermal Diode
The Celeron processor on 0.13 micron process incorporates an on-die thermal diode. A thermal
sensor located on the system board may monitor the die temperature of the processor for thermal
parameter and interface specifications. This thermal diode is separate from the Thermal Monitor’s
thermal sensor and cannot be used to predict the behavior of the Thermal Monitor.
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. Characterized at 75
°C.
3. Not 100% tested. Specified by design characterization.
4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode
equation:
IFW=Is *(e
(qVD/nkT) -1)
Where IS = saturation current, q = electronic charge, VD = voltage across the diode, k = Boltzmann Constant,
and T = absolute temperature (Kelvin).
5. The series resistance, RT, is provided to allow for a more accurate measurement of the diode junction
temperature. RT as defined includes the pins of the processor but does not include any socket resistance or
board trace resistance between the socket and the external remote diode thermal sensor. RT can be used by
remote diode thermal sensors with automatic series resistance cancellation to calibrate out this error term.
Another application is that a temperature offset can be manually calculated and programmed into an offset
register in the remote diode thermal sensors as exemplified by the equation:
Terror = [RT*(N-1)*IFWmin]/[(nk/q)*ln N]
Where Terror = sensor temperature error, N = sensor current ration, k = Boltzmann Constant, q = electronic
charge.
Table 39. Thermal Diode Parameters
Symbol
Parameter
Min
Typ
Max
Unit
Notes1
IFW
Forward Bias Current
5
300
A
1
n
Diode Ideality Factor
1.0011
1.0021
1.0030
2, 3, 4
RT
Series Resistance
3.64
2, 3, 4
Table 40. Thermal Diode Interface
Pin Name
Pin Number
Pin Description
THERMDA
B3
Diode anode
THERMDC
C4
Diode cathode
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532RC060128S L6ZY | 制造商:Intel 功能描述:MPU Celeron? Processor 0.13um 2.5GHz 478-Pin FCPGA2 制造商:Intel 功能描述:NORTHWOOD; MPU CELERON 0.13UM 2.5GHZ 478PIN FCPGA2 - Trays |
| RK80532RC060128SL72B | 功能描述:IC CELERON 2.5GHZ 478FC-PGA2 RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:2 系列:MPC8xx 处理器类型:32-位 MPC8xx PowerQUICC 特点:- 速度:133MHz 电压:3.3V 安装类型:表面贴装 封装/外壳:357-BBGA 供应商设备封装:357-PBGA（25x25） 包装:托盘 |
| RK80532RC064128 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RK805346RE067256 | 制造商:Intel 功能描述:TRAY CELERON D 330 - Trays |
| RK80546KF0871M | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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