参数资料
型号: ADSP-21375KSWZ-2B
厂商: Analog Devices Inc
文件页数: 50/56页
文件大小: 0K
描述: IC DSP 32BIT 266MHZ 208-MQFP
产品培训模块: SHARC Processor Overview
标准包装: 36
系列: SHARC®
类型: 浮点
接口: DAI,DPI
时钟速率: 266MHz
非易失内存: ROM(256 kB)
芯片上RAM: 64kB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.20V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 208-LQFP 裸露焊盘
供应商设备封装: 208-LQFP-EP(28x28)
包装: 托盘
Values of ? JB are provided for package comparison and PCB
10
design considerations. Note that the thermal characteristics val-
ues provided in Table 42 are modeled values.
8
6
Y = 0.04 88 X - 1.592 3
Table 42. Thermal Characteristics for 208-Lead LQFP
E_PAD (With Exposed Pad Soldered to PCB)
4
2
0
-2
Parameter
? JA
? JMA
? JMA
? JC
? JT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Typical
17.1
14.7
14.0
9.6
0.23
Unit
? C/W
? C/W
? C/W
? C/W
? C/W
-4
0
50
100 150
LOAD CAPACITANCE (pF)
200
? JMT
? JMT
? JB
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
0.39
0.45
11.5
? C/W
? C/W
? C/W
Figure 41. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
? JMB
? JMB
Airflow = 1 m/s
Airflow = 2 m/s
11.2
11.0
? C/W
? C/W
THERMAL CHARACTERISTICS
The processor is rated for performance over the temperature
range specified in Operating Conditions on Page 16 .
Table 42 airflow measurements comply with JEDEC standards
JESD51-2 and JESD51-6 and the junction-to-board measure-
ment complies with JESD51-8. Test board design complies with
JEDEC standard JESD51-7 (LQFP_EP). The junction-to-case
measurement complies with MIL- STD-883. All measurements
use a 2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use
T J = T CASE + ? ? JT ? P D ?
where:
T J = junction temperature ? C
T CASE = case temperature ( ? C) measured at the top center of the
package
? JT = junction-to-top (of package) characterization parameter
is the Typical value from Table 42 .
P D = power dissipation
Values of ? JA are provided for package comparison and PCB
design considerations. ? JA can be used for a first order approxi-
mation of T J by the equation
T J = T A + ? ? JA ? P D ?
where:
T A = ambient temperature ? C
Values of ? JC are provided for package comparison and PCB
design considerations when an external heatsink is required.
Rev. D | Page 50 of 56 | April 2013
相关PDF资料
PDF描述
EEM06DRKH CONN EDGECARD 12POS DIP .156 SLD
SMK316B7682KF-T CAP CER 6800PF 630V 10% X7R 1206
ECC22DCAH CONN EDGECARD 44POS R/A .100 SLD
XC95144XL-5TQ100C IC CPLD 144 MCELL 3.3V 100-TQFP
VE-20F-CY-F2 CONVERTER MOD DC/DC 72V 50W
相关代理商/技术参数
参数描述
ADSP-21375KSWZ-2B2 制造商:AD 制造商全称:Analog Devices 功能描述:SHARC Processor optimized for high performance audio processing
ADSP-21375KSWZ-2BX 制造商:Analog Devices 功能描述:- Trays
ADSP-21375KSZ-2B 制造商:Analog Devices 功能描述:DSP FLOATING PT 32BIT/40-BIT 266MHZ 266MIPS 208MQFP - Trays
ADSP-21375KSZ-2BX 制造商:Analog Devices 功能描述:266 MHZ.PROC W/ON CHIPROM,S/PDIF PBFREE - Trays
ADSP-21375KSZ-ENG 制造商:AD 制造商全称:Analog Devices 功能描述:SHARC Processor