参数资料
型号: ADSP-21375KSWZ-2B
厂商: Analog Devices Inc
文件页数: 55/56页
文件大小: 0K
描述: IC DSP 32BIT 266MHZ 208-MQFP
产品培训模块: SHARC Processor Overview
标准包装: 36
系列: SHARC®
类型: 浮点
接口: DAI,DPI
时钟速率: 266MHz
非易失内存: ROM(256 kB)
芯片上RAM: 64kB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.20V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 208-LQFP 裸露焊盘
供应商设备封装: 208-LQFP-EP(28x28)
包装: 托盘
PACKAGE DIMENSIONS
The processors are available in a 208-lead RoHS compliant
LQFP_EP package.
30.2 0
0.75
0.60
0.45
1.00 REF
1.60 MAX
208
1
30.0 0 SQ
29.80
28.1 0
28.0 0 SQ
27.90
157
156
157
156
8.712
REF
25.50
REF
208
1
SEATING
PLANE
PIN 1
1.45
1.40
1.35
0.20
0.15
0.09
TOP VIEW
(PINS DOWN)
*EXPOSED
PAD
8.890
REF
0.15
0.10
0.05 0.08
COPLANARITY
3.5 °
52
53
105
104
105
104
BOTTOM VIEW
(PINS UP)
53
52
VIEW A
ROTATED 90° CCW
VIEW A
0.50
BSC
LEAD PITCH
0.27
0.22
0.17
COMPLIANT TO JEDEC STANDARDS MS-026-BJB-HD
*NOTE:
THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND THERMALLY CONNECTED TO GND.
THIS SHOULD BE IMPLEMENTED BY SOLDERING THE EXPOSED PAD TO A GND PCB LAND THAT IS THE SAME SIZE
AS THE EXPOSED PAD. THE GND PCB LAND SHOULD BE ROBUSTLY CONNECTED TO THE GND PLANE IN THE PCB
WITH AN ARRAY OF THERMAL VIAS FOR BEST PERFORMANCE.
Figure 42. 208-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP]
(SW-208-1)
Dimensions shown in millimeters
Rev. D | Page 55 of 56 | April 2013
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