参数资料
型号: MT42L192M32D3LE-3 IT:A
厂商: Micron Technology Inc
文件页数: 163/164页
文件大小: 0K
描述: IC LPDDR2 SDRAM 8GBIT 168FBGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: 移动 LPDDR2 SDRAM
存储容量: 6G(192M x 32)
速度: 333MHz
接口: 并联
电源电压: 1.14 V ~ 1.3 V
工作温度: -25°C ~ 85°C
封装/外壳: 168-VFBGA
供应商设备封装: 168-FBGA(12x12)
包装: 散装
2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Revision History
Revision History
Rev. N, Production – 3/12
? Changed B2 and B26 balls from V ACC to NC on the 220-Ball 2-Channel FBGA - 14mm x
14mm figure
Rev. M, Production – 10/11
? Changed AT temperature range to -40°C to +105°C in 2Gb LPDDR2 part numbering
figure
? Added "Triple- and" to Figure: 168-Ball FBGA 12mm x 12mm Quad-Die Package (3DP,
QDP)
Rev. L, Production – 09/11
? Corrected outer ball dimensions of the LE package drawing to 11mm x 11mm
? Deleted S4A configuration information
Rev. K, Production – 08/11
? Updated t ZQCS, from 180ns to 90ns
Rev. J, Production – 05/11
? Removed the 240 ball package information to create a separate 240 ball data sheet
Rev. H, Production – 3/11
? Added MT42L192M32 part number
? Split previous table 2 into a single channel configuration table and a dual channel
configuration table
? Added package block diagram for the dual rank single channel 3 die configuration
? Added 168-ball and 220-ball package drawings
Rev. G, Production – 1/11
?
?
?
?
Changed status to Production
Added 220-ball package and drawings (MP)
Added 240-ball package and drawings (MQ)
Updated I DD02 , I DD3N , and I DDNS
Rev. F, Advance – 11/10
? Corrected pin states for I DD4R and I DD4W
Rev. E, Advance – 09/10
? Low temperature range changed from –40°C to –25°C
Rev. D, Advance – 07/10
? Updated Table 2.
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
163
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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