参数资料
型号: MT42L192M32D3LE-3 IT:A
厂商: Micron Technology Inc
文件页数: 46/164页
文件大小: 0K
描述: IC LPDDR2 SDRAM 8GBIT 168FBGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: 移动 LPDDR2 SDRAM
存储容量: 6G(192M x 32)
速度: 333MHz
接口: 并联
电源电压: 1.14 V ~ 1.3 V
工作温度: -25°C ~ 85°C
封装/外壳: 168-VFBGA
供应商设备封装: 168-FBGA(12x12)
包装: 散装
2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Mode Register Definition
Table 14: MR1 Op-Code Bit Definitions (Continued)
Feature
BT = burst type
Type
Write-only
OP
OP3
Definition
0b: Sequential (default)
Notes
1b: Interleaved
WC = wrap control
Write-only
OP4
0b: Wrap (default)
1b: No wrap
n WR = number of t WR clock
Write-only
OP[7:5]
001b: n WR = 3 (default)
1
cycles
Note:
010b: n WR = 4
011b: n WR = 5
100b: n WR = 6
101b: n WR = 7
110b: n WR = 8
All others: Reserved
1. The programmed value in n WR register is the number of clock cycles that determines
when to start internal precharge operation for a WRITE burst with AP enabled. It is de-
termined by RU ( t WR/ t CK).
Table 15: Burst Sequence by Burst Length (BL), Burst Type (BT), and Wrap Control (WC)
Notes 1–5 apply to all parameters and conditions
Burst C ycle Number and Burst Address Sequence
BL
BT
C3
C2
C1
C0
WC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
4
Any
X
X
0b
0b
Wrap
0
1
2
3
X
X
1b
0b
2
3
0
1
Any
X
X
X
0b
No
y
y + y + y +
wrap
1
2
3
8
Seq
X
0b
0b
0b
Wrap
0
1
2
3
4
5
6
7
X
X
X
0b
1b
1b
1b
0b
1b
0b
0b
0b
2
4
6
3
5
7
4
6
0
5
7
1
6
0
2
7
1
3
0
2
4
1
3
5
Int
X
X
X
X
0b
0b
1b
1b
0b
1b
0b
1b
0b
0b
0b
0b
0
2
4
6
1
3
5
7
2
0
6
4
3
1
7
5
4
6
0
2
5
7
1
3
6
4
2
0
7
5
3
1
Any
X
X
X
0b
No
Illegal (not supported)
wrap
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
46
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
相关PDF资料
PDF描述
IDT71T75802S166BGG IC SRAM 18MBIT 166MHZ 119BGA
HSC31DTES CONN EDGECARD 62POS .100 EYELET
HMC31DTES CONN EDGECARD 62POS .100 EYELET
FMC43DRYN-S734 CONN EDGECARD 86POS DIP .100 SLD
FMC43DRYH-S734 CONN EDGECARD 86POS DIP .100 SLD
相关代理商/技术参数
参数描述