参数资料
型号: RC28F160C3BD70
厂商: INTEL CORP
元件分类: PROM
英文描述: 1M X 16 FLASH 3V PROM, 70 ns, PBGA64
封装: BGA-64
文件页数: 69/72页
文件大小: 1083K
代理商: RC28F160C3BD70
Intel Advanced+ Boot Block Flash Memory (C3)
Datasheet
Intel Advanced+ Boot Block Flash Memory (C3)
May 2005
Order Number: 290645, Revision: 023
71
Appendix E Ordering Information
Figure 23.
Component Ordering Information
Package
TE = 48- Lead TSOP
GT = 48- Ball BGA * CSP
GE = VF BGA CSP
RC = Easy BGA
PC = Pb Free Easy BGA
PH = Pb Free VFBGA
JS = Pb Free TSOP
Product line designator
for all Intel
Flash products
Access Speed (ns)
(70, 80 , 90, 100 , 110 )
Product Family
C3 = 3 Volt Advanced+ Boot Block
VCC = 2.7 V–3.6 V
VPP = 2.7 V–3.6 V or
11
.4 V–12 .6 V
Device Density
640 = x16 (64 Mbit)
320 = x16 (32 Mbit)
160 = x16 (16 Mbit)
800 = x16 (8 Mbit)
T = Top Blocking
B = Bottom Blocking
Lithography
A = 0.25 m
C = 0.18 m
D = 0.13 m
T E 2 8 F 3 2 0 C 3 T C 7 0
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RC28F160C3TA110 制造商:INTEL 制造商全称:Intel Corporation 功能描述:Advanced+ Boot Block Flash Memory (C3)
RC28F160C3TA70 制造商:INTEL 制造商全称:Intel Corporation 功能描述:Advanced+ Boot Block Flash Memory (C3)
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