参数资料
型号: PF38F3352LLZDQ0
厂商: INTEL CORP
元件分类: 存储器
英文描述: SPECIALTY MEMORY CIRCUIT, PBGA88
封装: 11 X 13 MM, SCSP-88
文件页数: 3/54页
文件大小: 966K
代理商: PF38F3352LLZDQ0
768-Mbit LVQ Family with Asynchronous Static RAM
Datasheet
11
3.0
Package Information
The 768-Mbit LVQ Family with Asynchronous Static RAM device is available with various die
combinations in both the standard Stacked Chip Scale Package (SCSP) and the Intel
Ultra-Thin
Stacked Chip Scale Package (Intel
UT-SCSP).
3.1
One- and Two-Die SCSP
Figure 2. Mechanical Specifications for One/Two-Die SCSP (8x10 mm)
Millimeters
Inches
Di mensions
Symbol
Min
Nom
Max
Notes
Min
Nom
Max
Pa ckage Height
A
1.200
0.0472
Ball Height
A1
0.200
0.0079
Pa ckage Body Thickness
A2
0.860
0.0339
Ball (Lead) Width
b
0.325
0.375
0.425
0.0128
0.0148
0.0167
Pa ckage Body Length
D
9.900
10.000
10.100
0.3898
0.3937
0.3976
Pa ckage Body Width
E
7.900
8.000
8.100
0.3110
0.3150
0.3189
Pitch
e
0.800
0.0315
Ball (Lead) Count
N
88
Se ating Plane Coplanarity
Y
0.100
0.0039
Corner to Ball A1 Distance Along E
S1
1.100
1.200
1.300
0.0433
0.0472
0.0512
Corner to Ball A1 Distance Along D
S2
0.500
0.600
0.700
0.0197
0.0236
0.0276
Top View - Ball Down
Bottom View - Ball
Up
A
A2
D
E
Y
A1
Draw ing not to scale.
S2
S1
A
C
B
E
D
G
F
J
H
K
L
M
e
1
2
3
4
5
6
7
8
b
A
C
B
E
D
G
F
J
H
K
L
M
A1 Index
Mark
12
345
678
8x10x1.2Q
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