- 您现在的位置：买卖IC网 > PDF目录299768 > PF38F3352LLZDQ0 (INTEL CORP) SPECIALTY MEMORY CIRCUIT, PBGA88 PDF资料下载
参数资料
| 型号： | PF38F3352LLZDQ0 |
| 厂商： | INTEL CORP |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA88 |
| 封装： | 11 X 13 MM, SCSP-88 |
| 文件页数： | 51/54页 |
| 文件大小： | 966K |
| 代理商： | PF38F3352LLZDQ0 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页当前第51页第52页第53页第54页
768-Mbit LVQ Family with Asynchronous Static RAM
6
Datasheet
Non-Array Reads
Flash reads which return flash Device Identifier, CFI Query, Protection
Register and Status Register information
Program
An operation to Write data to the flash array
Write
Bus cycle operation at the inputs of the flash die, in which a command
or data are sent to the flash array
Block
Group of cells, bits, bytes or words within the flash memory array that
get erased with one erase instruction
Parameter block
Any 16-Kword flash array block.
Main block
Any 64-Kword flash array block.
Top parameter
Previously referred to as a top-boot device, a device with flash
parameter partition located at the highest physical address of its
memory map for processor system boot up.
Bottom parameter
Previously referred to as a bottom-boot device, a device with flash
parameter partition located at the lowest physical address of its memory
map for processor system boot up.
Bottom-Top parameter
Stacked-CSP device configuration of two flash dies in the same
segment arranged with the parameter partitions located at the lowest
and highest physical address of its memory map.
Partition
A group of flash blocks that shares common status register read state.
Parameter partition
A flash partition containing parameter and main blocks.
Main partition
A flash partition containing only main blocks.
Die
Individual physical flash die used in a stacked-CSP memory subsystem
device
Segment
A section of the SCSP memory subsystem divided for different
operating characteristics. The SCSP memory subsystem has three
segments: a code segment, a data segment, and an xRAM segment.
Code segment
A segment that contains one or two flash memory dies optimized for
fast code or data reads. Each die features multi-partition synchronous
read-while-write or burst read-while-erase capability.
Data segment
A segment contains one or two flash memory dies optimized for large
embedded data. Each die feature single-partition asynchronous read,
write, and erase operations.
xRAM segment
A segment contains one or two xRAM memory dies. The xRAM
combinations could include SRAM, PSRAM, or LPSDRAM.
Subsystem
A stacked memory integration concept made up of multiple memory
dies arranged in Code, Data, and xRAM segments.
Device
An individual flash die or a flash + xRAM SCSP.
相关PDF资料 |
PDF描述 |
|---|---|
| PF38F40L0YUQ0 | 16M X 16 FLASH 1.8V PROM, PBGA88 |
| PF50WIW2K-3.5VF-W6 | SINGLE COLOR LED, INCAND WHITE |
| PD50WO3K-28V-T | SINGLE COLOR LED, SUPER ORANGE |
| PD50WR3K-24V-W6 | SINGLE COLOR LED, ULTRA RED |
| PF50WAG6K-240VAC-W6 | SINGLE COLOR LED, AQUA GREEN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PF38F4040L0YWA | 制造商:Micron Technology Inc 功能描述:256LCR/32PS SCSP 1.8 HF NOKIA - Tape and Reel |
| PF38F4040L0YWAGB | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |
| PF38F4050L0YWQEA | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| PF38F4050L0ZTQ0 | 制造商:Intel 功能描述:MM#869453 FLASH |
| PF38F4050M0Y0CEA | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
发布紧急采购，3分钟左右您将得到回复。