参数资料
型号: RC28F00BM29EWHA
厂商: Micron Technology Inc
文件页数: 14/75页
文件大小: 0K
描述: IC FLASH 2GBIT 100NS 64FBGA
标准包装: 184
系列: Axcell™
格式 - 存储器: 闪存
存储器类型: 闪存 - 或非
存储容量: 2G(256M x 8,128M x 16)
速度: 100ns
接口: 并联
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 64-LBGA
供应商设备封装: 64-FBGA(11x13)
包装: 托盘

256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR Flash
Bus Operations
Bus Operations
Table 6: Bus Operations
Notes 1 and 2 apply to entire table
A[MAX:0],
8-Bit Mode
16-Bit Mode
DQ15/A-1,
Operation
CE# OE# WE# RST# V PP /WP#
DQ15/A-1
DQ[14:8]
DQ[7:0]
A[MAX:0]
DQ[14:0]
READ
L
L
H
H
X
Cell address
High-Z
Data output
Cell address
Data output
WRITE
L
H
L
H
H 3
Command
High-Z
Data
input 4
Command
Data input 4
address
address
STANDBY
OUTPUT
H
L
X
H
X
H
H
H
H
X
X
X
High-Z
High-Z
High-Z
High-Z
X
X
High-Z
High-Z
DISABLE
RESET
X
X
X
L
X
X
High-Z
High-Z
X
High-Z
Notes:
1. Typical glitches of less than 3ns on CE#, WE#, and RST# are ignored by the device and do
not affect bus operations.
2. H = Logic level HIGH (V IH ); L = Logic level LOW (V IL ); X = HIGH or LOW.
3. If WP# is LOW, then the highest or the lowest block remains protected, depending on
line item.
4. Data input is required when issuing a command sequence or when performing data
polling or block protection.
Read
Bus READ operations read from the memory cells, registers, or CFI space. To accelerate
the READ operation, the memory array can be read in page mode where data is inter-
nally read and stored in a page buffer.
Page size is 16 words (32 bytes) and is addressed by address inputs A[3:0] in x16 bus
mode and A[3:0] plus DQ15/A-1 in x8 bus mode. The extended memory blocks and CFI
area do not support page read mode.
A valid bus READ operation involves setting the desired address on the address inputs,
taking CE# and OE# LOW, and holding WE# HIGH. The data I/Os will output the value.
(See AC Characteristics for details about when the output becomes valid.)
Write
Bus WRITE operations write to the command interface. A valid bus WRITE operation
begins by setting the desired address on the address inputs. The address inputs are
latched by the command interface on the falling edge of CE# or WE#, whichever occurs
last. The data I/Os are latched by the command interface on the rising edge of CE# or
WE#, whichever occurs first. OE# must remain HIGH during the entire bus WRITE oper-
ation. (See AC Characteristics for timing requirement details.)
Standby
Driving CE# HIGH in read mode causes the device to enter standby, and data I/Os to be
High-Z. To reduce the supply current to the standby supply current (I CC2 ), CE# must be
held within V CC ±0.3V. (See DC Characteristics.)
PDF: 09005aef849b4b09
m29ew_256mb_2gb.pdf - Rev. B 8/12 EN
14
Micron Technology, Inc. reserves the right to change products or specifications without notice.
? 2012 Micron Technology, Inc. All rights reserved.
相关PDF资料
PDF描述
RDK-242 KIT REF DESIGN VG TOPSWITCH-JX
RJCSE538001 CONN MOD JACK 8P8C SMT R/A
RJE031882420 CONN MOD JACK 8P/8C S-FLANGES
RJE051660310 CONN MOD JACK 6P/6C UNSHIELDED
RJE051880110 CONN MOD JACK 8/8 R/A UNSHIELDED
相关代理商/技术参数
参数描述
RC28F128J3A_13 制造商:INTEL 制造商全称:Intel Corporation 功能描述:Intel StrataFlash?? Memory
RC28F128J3A-110 制造商:INTEL 制造商全称:Intel Corporation 功能描述:Intel StrataFlash Memory (J3)
RC28F128J3A-115 制造商:INTEL 制造商全称:Intel Corporation 功能描述:Intel StrataFlash Memory (J3)
RC28F128J3A-120 制造商:INTEL 制造商全称:Intel Corporation 功能描述:Intel StrataFlash Memory (J3)
RC28F128J3A-125 制造商:INTEL 制造商全称:Intel Corporation 功能描述:Intel StrataFlash Memory (J3)