参数资料
型号: S71PL129JC0BFW9Z2
厂商: SPANSION LLC
元件分类: 存储器
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA64
封装: 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64
文件页数: 95/153页
文件大小: 3651K
代理商: S71PL129JC0BFW9Z2
44
S71PL129JC0/S71PL129JB0/S71PL129JA0
S71PL129Jxx_00_A8 October 28, 2005
Advance
Info rmation
43h
0031h
Major version number, ASCII (reflects modifications to the silicon)
44h
0033h
Minor version number, ASCII (reflects modifications to the CFI table)
45h
TBD
Address Sensitive Unlock (Bits 1-0)
0 = Required, 1 = Not Required
Silicon Revision Number (Bits 7-2)
46h
0002h
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
47h
0001h
Sector Protect
0 = Not Supported, X = Number of sectors in per group
48h
0001h
Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
49h
0007h (PLxxxJ)
Sector Protect/Unprotect scheme
07 = Advanced Sector Protection
4Ah
00E7h (PL129J)
Simultaneous Operation
00 = Not Supported, X = Number of Sectors excluding Bank 1
4Bh
0000h
Burst Mode Type
00 = Not Supported, 01 = Supported
4Ch
0002h (PLxxxJ)
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
4Dh
0085h
ACC (Acceleration) Supply Minimum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
4Eh
0095h
ACC (Acceleration) Supply Maximum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
4Fh
0001h
Top/Bottom Boot Sector Flag
00h = Uniform device, 01h = Both top and bottom boot with write protect,
02h = Bottom Boot Device, 03h = Top Boot Device,
04h = Both Top and Bottom
50h
0001h
Program Suspend
0 = Not supported, 1 = Supported
57h
0004h
Bank Organization
00 = Data at 4Ah is zero, X = Number of Banks
58h
0027h (PL129J)
Bank 1 Region Information
X = Number of Sectors in Bank 1
59h
0060h (PL129J)
Bank 2 Region Information
X = Number of Sectors in Bank 2
5Ah
0060h (PL129J)
Bank 3 Region Information
X = Number of Sectors in Bank 3
5Bh
0027h (PL129J)
Bank 4 Region Information
X = Number of Sectors in Bank 4
Table 11. Primary Vendor-Specific Extended Query (Sheet 2 of 2)
Addresses
Data
Description
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