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参数资料
| 型号： | SDED7-256M-N9T |
| 厂商： | SANDISK CORP |
| 元件分类： | 存储控制器/管理单元 |
| 英文描述： | FLASH MEMORY DRIVE CONTROLLER, PBGA115 |
| 封装： | 12 X 9 MM, 1.20 MM HEIGHT, FBGA-115 |
| 文件页数： | 5/87页 |
| 文件大小： | 1675K |
| 代理商： | SDED7-256M-N9T |
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Rev. 1.2
Product Overview
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
13
92-DS-1205-10
2.
PRODUCT OVERVIEW
2.1
Product Description
mDOC H3 is the latest addition to SanDisk’s mDOC product family. mDOC H3, packaged in a
small FBGA package and offering densities ranging from 1Gb (128MB) to 16Gb (2GB), is a
hybrid device with an embedded flash controller and high capacity flash memory. It uses
advanced Flash technologies, enhanced by SanDisk’s proprietary TrueFFS embedded flash
management software.
All mDOC H3 devices are ball to ball compatible. The replacement of one mDOC H3 device
with another of a newer generation requires virtually no changes to the host. This makes mDOC
H3 the perfect solution for platforms and reference designs, as it allows for the utilization of
more advanced NAND Flash technology and new mDOC functionality with minimal integration
efforts.
mDOC H3 has a 32KB Programmable Boot Block. This block provides eXecute In Place (XIP)
functionality, enabling mDOC H3 to replace the boot device and to function as the only
non-volatile memory device on-board. Eliminating the need for an additional boot device
reduces hardware expenditures, board real estate, programming time, and logistics. The Paged
RAM IPL feature separates the Boot Block into sections: The first section provides constant
data, while the other sections (up to 254KB) can be loaded with data that is automatically
downloaded from the flash. One application of this feature is to support processors’ secure boot
requirements.
Sandisk’s proprietary TrueFFS flash management software overcomes NAND-related error
patterns by using a robust error detection and correction (EDC/ECC) mechanism. Furthermore, it
provides performance enhancements such as multi-plane operations, DMA support, Burst
operation and Dual Data RAM buffering.
The new generation of patented flash management software, Embedded TrueFFS, is run on the
embedded thin controller of the mDOC H3 device, instead of on the host. This results in
improvements in performance, ease of integration and overall utilization of latest NAND
technologies. Embedded TrueFFS guarantees high reliability and isolates all the complexity of
flash management from the host SW.
Embedded TrueFFS enables mDOC H3 to fully emulate a hard disk to the host processor,
enabling read/write operations that are identical to a standard, sector-based hard drive. In
addition, Embedded TrueFFS employs patented methods, such as virtual mapping, dynamic and
static wear-leveling, and automatic bad block management to ensure high data reliability and
maximize flash life expectancy. mDOC H3 extended features are enabled by a small driver that
runs on the host side, called DOC Driver. DOC Driver provides the host O/S with a standard
Block Device interface, together with APIs for mDOC H3’s extended features. The combination
of Embedded TrueFFS and DOC Driver practically enables Plug and Play integration.
mDOC H3 offers extended content protection and security-enabling features. Up to 14 write
protected, read-and-write protected, or One Time Programmable (OTP) partitions can be
configured independently for maximum design flexibility. A 16-byte Unique ID (UID) identifies
each device, eliminating the need for a separate ID device on the motherboard. The combination
相关PDF资料 |
PDF描述 |
|---|---|
| SDED7-256M-N9Y | FLASH MEMORY DRIVE CONTROLLER, PBGA115 |
| SPMC68336AVFT20 | 32-BIT, MROM, 20.97 MHz, MICROCONTROLLER, PQFP160 |
| SPMC68336GCFT20 | 32-BIT, MROM, 20.97 MHz, MICROCONTROLLER, PQFP160 |
| SC104002VPVR2 | 16-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP112 |
| S9S12XF512J0MLH | MICROCONTROLLER, QFP64 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| SDED7-256M-N9Y | 功能描述:IC MDOC H3 256MB FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF) |
| SDED7-512M-NAT | 功能描述:IC MDOC H3 512MB FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF) |
| SDED7-512M-NAY | 功能描述:IC MDOC H3 512MB FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF) |
| SDEG-15P | 制造商:HRS 制造商全称:HRS 功能描述:STRAIGHT/METAL PCB D-SUB |
| SDEG-15P05 | 制造商:HRS 制造商全称:HRS 功能描述:STRAIGHT/METAL PCB D-SUB |
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