参数资料
| 型号： | W25Q64FVSSIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 12/89页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 64MBIT 8SOIC |
| 标准包装： | 90 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 64M（8M x 8） |
| 速度： | 80MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页当前第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页
W25Q64FV
5.
FUNCTIONAL DESCRIPTIONS
5.1 SPI/QPI OPERATIONS
Power On
Reset (66h + 99h)
Device
Initialization
Standard SPI
Dual SPI
Reset (66h + 99h)
Enable QPI (38h)
QPI
Quad SPI
Disable QPI (FFh)
operations
operations
Figure 3. W25Q64FV Serial Flash Memory Operation Diagram
5.1.1
Standard SPI Instructions
The W25Q64FV is accessed through an SPI compatible bus consisting of four signals: Serial Clock (CLK),
Chip Select (/CS), Serial Data Input (DI) and Serial Data Output (DO). Standard SPI instructions use the
DI input pin to serially write instructions, addresses or data to the device on the rising edge of CLK. The
DO output pin is used to read data or status from the device on the falling edge of CLK.
SPI bus operation Mode 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and
Mode 3 concerns the normal state of the CLK signal when the SPI bus master is in standby and data is
not being transferred to the Serial Flash. For Mode 0, the CLK signal is normally low on the falling and
rising edges of /CS. For Mode 3, the CLK signal is normally high on the falling and rising edges of /CS.
5.1.2
Dual SPI Instructions
The W25Q64FV supports Dual SPI operation when using instructions such as “ Fast Read Dual Output
(3Bh)” and “Fast Read Dual I/O (BBh) ” . These instructions allow data to be transferred to or from the
device at two to three times the rate of ordinary Serial Flash devices. The Dual SPI Read instructions are
ideal for quickly downloading code to RAM upon power-up (code-shadowing) or for executing non-speed-
critical code directly from the SPI bus (XIP). When using Dual SPI instructions, the DI and DO pins
become bidirectional I/O pins: IO0 and IO1.
- 12 -
相关PDF资料 |
PDF描述 |
|---|---|
| EP1AGX35DF780I6 | IC ARRIA GX FPGA 35K 780FBGA |
| EP1AGX35DF780I6N | IC ARRIA GX FPGA 35K 780FBGA |
| EP4CE115F23C9L | IC CYCLONE IV FPGA 115K 484-FBGA |
| EP4CE115F23C8 | IC CYCLONE IV FPGA 115K 484-FBGA |
| A3PE3000L-1FG484 | IC FPGA 1KB FLASH 3M 484-FBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q64FVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 8SOIC 制造商:Winbond 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM |
| W25Q64FVSSIG/TRAY | 制造商:Winbond Electronics Corp 功能描述: |
| W25Q64FVSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q64FVTCIG | 制造商:Winbond Electronics Corp 功能描述:64MBIT SPI |
| W25Q64FVTCIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
发布紧急采购，3分钟左右您将得到回复。