参数资料
| 型号： | W25Q64FVSSIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 4/89页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 64MBIT 8SOIC |
| 标准包装： | 90 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 64M（8M x 8） |
| 速度： | 80MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q64FV
6.2.36
6.2.37
6.2.38
6.2.39
6.2.40
6.2.41
6.2.42
6.2.43
Erase Security Registers (44h) ........................................................................................... 63
Program Security Registers (42h) ...................................................................................... 64
Read Security Registers (48h) ........................................................................................... 65
Set Read Parameters (C0h) ............................................................................................... 66
Burst Read with Wrap (0Ch) ............................................................................................... 67
Enable QPI (38h) ................................................................................................................ 68
Disable QPI (FFh) .............................................................................................................. 69
Enable Reset (66h) and Reset (99h) .................................................................................. 70
7.
ELECTRICAL CHARACTERISTICS .............................................................................................. 71
7.1
7.2
7.3
7.4
7.5
7.6
Absolute Maximum Ratings (1)(2) ...................................................................................... 71
Operating Ranges .............................................................................................................. 71
Power-up Power-down Timing and Requirements(1) ........................................................ 72
DC Electrical Characteristics .............................................................................................. 73
AC Measurement Conditions(1) ......................................................................................... 74
AC Electrical Characteristics .............................................................................................. 75
AC Electrical Characteristics (cont’d) ............................................................................................. 76
7.7
7.8
7.9
7.10
Serial Output Timing ........................................................................................................... 77
Serial Input Timing.............................................................................................................. 77
HOLD Timing ...................................................................................................................... 77
WP Timing .......................................................................................................................... 77
8.
PACKAGE SPECIFICATION .......................................................................................................... 78
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 78
8-Pin VSOP 208-mil (Package Code ST) .......................................................................... 79
8-Pin PDIP 300-mil (Package Code DA)............................................................................ 80
8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 81
8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 82
16-Pin SOIC 300-mil (Package Code SF).......................................................................... 83
24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) ......................................... 84
24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................ 85
Ordering Information .......................................................................................................... 86
Valid Part Numbers and Top Side Marking ........................................................................ 87
9.
REVISION HISTORY ...................................................................................................................... 88
-4-
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q64FVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 8SOIC 制造商:Winbond 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM |
| W25Q64FVSSIG/TRAY | 制造商:Winbond Electronics Corp 功能描述: |
| W25Q64FVSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q64FVTCIG | 制造商:Winbond Electronics Corp 功能描述:64MBIT SPI |
| W25Q64FVTCIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
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