参数资料
型号: W25Q64FVSSIG
厂商: Winbond Electronics
文件页数: 58/89页
文件大小: 0K
描述: IC SPI FLASH 64MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 80MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q64FV
6.2.31
Read Manufacturer / Device ID Dual I/O (92h)
The Read Manufacturer / Device ID Dual I/O instruction is an alternative to the Read Manufacturer /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID
at 2x speed.
The Read Manufacturer / Device ID Dual I/O instruction is similar to the Fast Read Dual I/O instruction.
The inst ruction is initiated by driving the /CS pin low and shifting the instruction code “9 2 h” followed by a
24-bit address (A23-A0) of 000000h, but with the capability to input the Address bits two bits per clock.
After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out 2 bits per clock on
the falling edge of CLK with most significant bits (MSB) first as shown in Figure 30. The Device ID values
for the W25Q64FV is listed in Manufacturer and Device Identification table. The Manufacturer and Device
IDs can be read continuously, alternating from one to the other. The instruction is completed by driving
/CS high.
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
CLK
Mode 0
Instruction (92h)
A23-16
A15-8
A7-0 (00h)
M7-0
DI
(IO 0 )
6
4
2
0
6
4
2
0
6
4
2
0
6
4
2
0
DO
(IO 1 )
* = MSB
High Impedance
7
*
5
3
1
7
*
5
3
1
7
*
5
3
1
7
*
5
3
1
/CS
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
Mode 3
CLK
IOs switch from
Input to Output
Mode 0
DI
(IO 0 )
0
6
4
2
0
6
4
2
0
6
4
2
0
6
4
2
0
DO
(IO 1 )
1
7
*
5 3
MFR ID
1
7
*
5 3
Device ID
1
7
*
5 3
MFR ID
(repeat)
1
7
*
5 3
Device ID
(repeat)
1
Figure 30. Read Manufacturer / Device ID Dual I/O Instruction (SPI Mode only)
Note:
The “Continuous Read Mode” bits M(7 -0) must be set to Fxh to be compatible with Fast Read Dual I/O instruction.
- 58 -
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