参数资料
型号: W25Q64FVSSIG
厂商: Winbond Electronics
文件页数: 20/89页
文件大小: 0K
描述: IC SPI FLASH 64MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 80MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q64FV
6.2
INSTRUCTIONS
The Standard/Dual/Quad SPI instruction set of the W25Q64FV consists of thirty six basic instructions that
are fully controlled through the SPI bus (see Instruction Set table1-3). Instructions are initiated with the
falling edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction
code. Data on the DI input is sampled on the rising edge of clock with most significant bit (MSB) first.
The QPI instruction set of the W25Q64FV consists of twenty four basic instructions that are fully
controlled through the SPI bus (see Instruction Set table 4). Instructions are initiated with the falling edge
of Chip Select (/CS). The first byte of data clocked through IO[3:0] pins provides the instruction code.
Data on all four IO pins are sampled on the rising edge of clock with most significant bit (MSB) first. All
QPI instructions, addresses, data and dummy bytes are using all four IO pins to transfer every byte of
data with every two serial clocks (CLK).
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, du mmy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in figures 5
through 42. All read instructions can be completed after any clocked bit. However, all instructions that
Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been
clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent
writes. Additionally, while the memory is being programmed or erased, or when the Status Register is
being written, all instructions except for Read Status Register will be ignored until the program or erase
cycle has completed.
6.2.1
Manufacturer and Device Identification
MANUFACTURER ID
Winbond Serial Flash
(MF7 - MF0)
EFh
Device ID
Instruction
W25Q64FV (SPI)
W25Q64FV (QPI)
(ID7 - ID0)
ABh, 90h, 92h, 94h
16h
16h
- 20 -
(ID15 - ID0)
9Fh
4017h
6017h
相关PDF资料
PDF描述
EP1AGX35DF780I6 IC ARRIA GX FPGA 35K 780FBGA
EP1AGX35DF780I6N IC ARRIA GX FPGA 35K 780FBGA
EP4CE115F23C9L IC CYCLONE IV FPGA 115K 484-FBGA
EP4CE115F23C8 IC CYCLONE IV FPGA 115K 484-FBGA
A3PE3000L-1FG484 IC FPGA 1KB FLASH 3M 484-FBGA
相关代理商/技术参数
参数描述
W25Q64FVSSIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 8SOIC 制造商:Winbond 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM
W25Q64FVSSIG/TRAY 制造商:Winbond Electronics Corp 功能描述:
W25Q64FVSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVTCIG 制造商:Winbond Electronics Corp 功能描述:64MBIT SPI
W25Q64FVTCIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI