参数资料
型号: W25Q64FVSSIG
厂商: Winbond Electronics
文件页数: 37/89页
文件大小: 0K
描述: IC SPI FLASH 64MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 80MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q64FV
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
CLK
Mode 0
A23-16
A15-8
A7-0
M7-0
Dummy
Dummy
IOs switch from
Input to Output
IO 0
IO 1
IO 2
IO 3
20
21
22
23
16
17
18
19
12
13
14
15
8
9
10
11
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
Byte 1
Byte 2
Byte 3
Figure 15b. Fast Read Quad I/O Instruction (Previous instruction set M5-4 = 10, SPI Mode)
Fast Read Quad I/O with “8/16/32/64 - Byte Wrap Around” in Standard SPI mode
The Fast Read Quad I/O instruction can also be used to access a specific portion within a page by
issuing a “Set Burst with Wrap” (77h) command prior to EBh. The “Set Burst with Wrap” (77h) command
can either enable or disable the “Wrap Around” feature for the following EBh commands. When “Wrap
Around” is enabled, the data being acce ssed can be limited to either a 8, 16, 32 or 64-byte section of a
256-byte page. The output data starts at the initial address specified in the instruction, once it reaches the
ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary
automatically until /CS is pulled high to terminate the command.
The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then
fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read
commands.
The “Set Burst with Wrap” instruction allows three “Wrap Bits”, W6 -4 to be set. The W4 bit is used to
enable or disable the “Wrap Around” operation while W6-5 are used to specify the length of the wrap
around section within a page. See 7.2.19 for detail descriptions.
- 37 -
Publication Release Date:
October 07, 2013
Revision L
相关PDF资料
PDF描述
EP1AGX35DF780I6 IC ARRIA GX FPGA 35K 780FBGA
EP1AGX35DF780I6N IC ARRIA GX FPGA 35K 780FBGA
EP4CE115F23C9L IC CYCLONE IV FPGA 115K 484-FBGA
EP4CE115F23C8 IC CYCLONE IV FPGA 115K 484-FBGA
A3PE3000L-1FG484 IC FPGA 1KB FLASH 3M 484-FBGA
相关代理商/技术参数
参数描述
W25Q64FVSSIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 8SOIC 制造商:Winbond 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM
W25Q64FVSSIG/TRAY 制造商:Winbond Electronics Corp 功能描述:
W25Q64FVSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVTCIG 制造商:Winbond Electronics Corp 功能描述:64MBIT SPI
W25Q64FVTCIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI