参数资料
型号: EWIXP455ABT
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 266 MHz, RISC PROCESSOR, PBGA544
封装: LEAD FREE, PLASTIC, BGA-544
文件页数: 28/163页
文件大小: 1123K
代理商: EWIXP455ABT
Electrical Specifications
Intel IXP45X and Intel IXP46X Product Line of Network Processors Datasheet
May 2005
Document Number: 306261-002
123
5.5.8
Expansion Bus DC Parameters
VOL
Output-low voltage
IOUT = 15mA
0.35
V
IIL
Input-leakage current
0 < VIN < VCCM
-10
10
A
CIO
I/O-pin capacitance
5
pF
Table 37.
Expansion Bus DC Parameters
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Notes
VIH
Input-high voltage
2.0
V
VIL
Input-low voltage
0.8
V
VOHDRV0
Output-high voltage
IOUT = -8 mA
2.4
V
1, 2
VOLDRV0
Output-low voltage
IOUT = 8 mA
0.4
V
1, 2
VOHDRV1
Output-high voltage
IOUT = -14 mA
2.4
V
1, 3
VOLDRV1
Output-low voltage
IOUT = 14mA
0.4
V
1, 3
VOHDRV2
Output-high voltage
IOUT = -20 mA
2.4
V
1, 4
VOLDRV2
Output-low voltage
IOUT = 20 mA
0.4
V
1, 4
IIL
Input-leakage current
0 < VIN < VCCP
-10
10
A
CIN
Input-pin capacitance
5
pF
NOTES:
1. These values are typical values seen by the manufacturing process and are not tested.
2. The values represented with this voltage parameter would typically be used in a system in which the
expansion bus interfaces a single load of 6pF placed less than 2 inches away from the IXP45X/IXP46X
network processors. This drive strength setting should be used to avoid ringing when minimal loading is
attached. Please use IBIS models and simulation tools to guarantee the design.
3. The values represented with this voltage parameter would typically be used in a system in which the
expansion bus interfaces four loads of 6pF each. All components are placed no further than 4 inches away
from the IXP45X/IXP46X network processors. This drive strength setting should be used to avoid ringing
when medium loading is attached. Please use IBIS models and simulation tools to guarantee the design.
4. The values represented with this voltage parameter would typically be used in a system in which the
expansion bus interfaces eight loads of 6pF and all components are placed less than 6 inches from the
IXP45X/IXP46X network processors. Another use case of this drive strength would typically be four loads
of 6pF operating at 80MHz. This drive strength setting should be used to avoid ringing when maximum
loading or frequency is utilized. Please use IBIS models and simulation tools to guarantee the design.
Table 36.
DDRI SDRAM Bus DC Parameters (Sheet 2 of 2)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Notes
NOTES:
1. These values are typical values seen by the manufacturing process and are not tested.
2. Only 2.5V DDRI SDRAM is supported
相关PDF资料
PDF描述
EX5-R-PL 16 CONTACT(S), MALE, COMBINATION LINE CONNECTOR, SOLDER
EXH2E106HR PLASTIC FILM CAPACITORS
EXH2E205HR PLASTIC FILM CAPACITORS
EXH2E255HR PLASTIC FILM CAPACITORS
EXH2E305HR PLASTIC FILM CAPACITORS
相关代理商/技术参数
参数描述
EWIXP455BAC 制造商:Rochester Electronics LLC 功能描述:- Bulk
EWIXP460BAD 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Intel 功能描述:
EWJKXA066A15 制造商:Panasonic Industrial Company 功能描述:CONTROL
EWK105BJ224MP-F 制造商:TAIYO YUDEN 功能描述:Cut Tape 制造商:Taiyo Yuden 功能描述:Ceramic capacitor LWDC 0402 220nF 制造商:Taiyo Yuden 功能描述:Cap Ceramic 0.22uF 16V X5R 20% SMD 0204 85 制造商:Taiyo Yuden 功能描述:Cap Ceramic 0.22uF 16V X5R 20% SMD 0204 85°C Paper T/R
EWK105BJ224MPHF 功能描述:CAP CER 0.22UF 16V X5R 0204 制造商:taiyo yuden 系列:LWDC?,LW 包装:剪切带(CT) 零件状态:在售 电容:0.22μF 容差:±20% 电压 - 额定:16V 温度系数:X5R 工作温度:-55°C ~ 85°C 特性:低 ESL 型(倒置结构) 等级:AEC-Q200 应用:汽车,旁通,去耦 故障率:- 安装类型:表面贴装,MLCC 封装/外壳:0204(0610 公制) 大小/尺寸:0.020" 长 x 0.039" 宽(0.52mm x 1.00mm) 高度 - 安装(最大值):- 厚度(最大值):0.014"(0.35mm) 引线间距:- 引线形式:- 标准包装:1