参数资料
型号: M68HC705UGANG
厂商: 飞思卡尔半导体(中国)有限公司
英文描述: High-density complementary metal oxide semiconductor (HCMOS) microcontroller unit
中文描述: 高密度互补金属氧化物半导体(HCMOS)微控制器
文件页数: 12/112页
文件大小: 809K
代理商: M68HC705UGANG
iv
MC68HC05BD3
Paragraph
Number
Page
Number
TITLE
9.2
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.2.6
9.3
9.3.1
9.3.2
9.3.3
9.3.4
9.3.5
9.3.6
9.3.7
9.3.8
9.3.9
9.3.10
Instruction set........................................................................................................9-3
Register/memory Instructions..........................................................................9-4
Branch instructions..........................................................................................9-4
Bit manipulation instructions............................................................................9-4
Read/modify/write instructions.........................................................................9-4
Control instructions..........................................................................................9-4
Tables...............................................................................................................9-4
Addressing modes.................................................................................................9-11
Inherent............................................................................................................9-11
Immediate........................................................................................................9-11
Direct ...............................................................................................................9-11
Extended..........................................................................................................9-12
Indexed, no offset ............................................................................................9-12
Indexed, 8-bit offset .........................................................................................9-12
Indexed, 16-bit offset .......................................................................................9-12
Relative............................................................................................................9-13
Bit set/clear......................................................................................................9-13
Bit test and branch...........................................................................................9-13
10
LOW POWER MODES
10.1
10.2
10.3
STOP Mode.........................................................................................................10-1
WAIT Mode..........................................................................................................10-1
COP Watchdog Timer Considerations.................................................................10-2
11
OPERATING MODES
11.1
11.2
11.3
User Mode (Normal Operation)...........................................................................11-2
Self-Check Mode.................................................................................................11-2
Bootstrap Mode...................................................................................................11-4
12
ELECTRICAL SPECIFICATIONS
12.1
12.2
12.3
12.4
12.5
12.6
Maximum Ratings................................................................................................12-1
Thermal Characteristics ......................................................................................12-1
DC Electrical Characteristics...............................................................................12-2
Control Timing .....................................................................................................12-3
M-Bus Timing ......................................................................................................12-4
Sync Signal Processor Timing.............................................................................12-5
TPG
10
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
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