参数资料
型号: MT45W2MV16BAFB-706LIT
元件分类: SRAM
英文描述: 2M X 16 PSEUDO STATIC RAM, 70 ns, PBGA54
封装: FBGA-54
文件页数: 48/55页
文件大小: 816K
代理商: MT45W2MV16BAFB-706LIT
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, and the Micron and M Logos are trademarks and/or service marks of Micron Technology, Inc.
CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
All other trademarks are the property of their respective owners.
2 MEG x 16
ASYNC/PAGE/BURST CellularRAM MEMORY
ADVANCE
09005aef80ec6f63
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Burst CellularRAM_32.fm - Rev. A 2/18/04 EN
52
2004 Micron Technology, Inc. All Rights Reserved.
Figure 44: 54-Ball FBGA
NOTE:
1. All dimensions in millimeters; MAX/MIN, or typical, as noted.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
Data Sheet Designation: ADVANCE
This data sheet contains initial descriptions of prod-
ucts still in development.
BALL A1 ID
0.70 ±0.05
SEATING PLANE
0.10 C
C
1.00 MAX
BALL A6
BALL A1
BALL A1 ID
0.75
TYP
0.75 TYP
1.875 ±0.050
3.75
6.00 ±0.10
3.00 ±0.05
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-REFLOW
DIAMETER IS 0.35.
54X 0.35
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag
or 96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: 0.30 SOLDER MASK DEFINED
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
6.00
3.05 ±0.05
4.00 ±0.05
8.00 ±0.10
相关PDF资料
PDF描述
MT28C128532W30EBW-F705P856BTWT SPECIALTY MEMORY CIRCUIT, PBGA77
M93C66-MB6TP 256 X 16 MICROWIRE BUS SERIAL EEPROM, DSO8
MT48V8M16LFB4-75M:G 8M X 16 SYNCHRONOUS DRAM, 5.4 ns, PBGA54
MS8256FKXA-12 256K X 8 MULTI DEVICE SRAM MODULE, 120 ns, DMA32
MT46V32M16BN-75IT 32M X 16 DDR DRAM, 0.75 ns, PBGA60
相关代理商/技术参数
参数描述
MT45W2MV16PFA-70 WT 制造商:Micron Technology Inc 功能描述:2MX16 PSRAM PLASTIC WIRELESS TEMP FBGA 1.8V ASYNCH PSEUDO ST - Trays
MT45W2MW16BABB-706 L WT 功能描述:IC PSRAM 32MBIT 70NS 54VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:378 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:8M(1M x 8,512K x 16) 速度:110ns 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-CBGA 供应商设备封装:48-CBGA(7x7) 包装:托盘
MT45W2MW16BABB-706 L WT TR 制造商:Micron Technology Inc 功能描述:PSRAM ASYNC 1 32MBIT 2MX16 70NS 54VFBGA - Tape and Reel
MT45W2MW16BABB-706 WT 制造商:Micron Technology Inc 功能描述:PSRAM Async 1 32M-Bit 2M x 16 70ns 54-Pin VFBGA Tray 制造商:Micron Technology Inc 功能描述:PSRAM ASYNC 1 32MBIT 2MX16 70NS 54VFBGA - Trays 制造商:Micron Technology Inc 功能描述:IC PSRAM 32MBIT 70NS 54VFBGA
MT45W2MW16BABB-706 WT TR 功能描述:IC PSRAM 32MBIT 70NS 54VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:96 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:16M(2M x 8,1M x 16) 速度:70ns 接口:并联 电源电压:2.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘