参数资料
型号: MT47H128M8HQ-187ELAT:E
元件分类: DRAM
英文描述: 128M X 8 DDR DRAM, 0.35 ns, PBGA60
封装: 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60
文件页数: 10/133页
文件大小: 9170K
Figure 60: WRITE Interrupted by WRITE
CK
CK#
Command
DQ
DQS, DQS#
WL = 3
WRITE1 a
T0
T1
T2
Don’t Care
Transitioning Data
DI
a
T3
T4
T5
T6
WRITE3 b
DI
b
T7
T8
T9
WL = 3
2-clock requirement
Address
A10
Valid6
Valid5
Valid4
NOP2
7
DI
a + 1
DI
a + 3
DI
a + 2
DI
b + 1
DI
b + 2
DI
b + 3
DI
b + 4
DI
b + 5
DI
b + 6
DI
b + 7
Notes: 1. BL = 8 required and auto precharge must be disabled (A10 = LOW).
2. The NOP or COMMAND INHIBIT commands are valid. The PRECHARGE command cannot
be issued to banks used for WRITEs at T0 and T2.
3. The interrupting WRITE command must be issued exactly 2 × tCK from previous WRITE.
4. The earliest WRITE-to-PRECHARGE timing for WRITE at T0 is WL + BL/2 + tWR where tWR
starts with T7 and not T5 (because BL = 8 from MR and not the truncated length).
5. The WRITE command can be issued to any valid bank and row address (WRITE command
at T0 and T2 can be either same bank or different bank).
6. Auto precharge can be either enabled (A10 = HIGH) or disabled (A10 = LOW) by the in-
terrupting WRITE command.
7. Subsequent rising DQS signals must align to the clock within tDQSS.
8. Example shown uses AL = 0; CL = 4, BL = 8.
1Gb: x4, x8, x16 DDR2 SDRAM
WRITE
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. S 10/09 EN
107
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
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MT47H128M8HQ-25AT 制造商:MICRON 制造商全称:Micron Technology 功能描述:DDR2 SDRAM
MT47H128M8HQ-25EAT 制造商:MICRON 制造商全称:Micron Technology 功能描述:DDR2 SDRAM