Table 11: AC Operating Specifications and Conditions (Continued)
Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table;
VDDQ = +1.8V ±0.1V, VDD = +1.8V ±0.1V
AC Characteristics
-187E
-25E
-25
-3E
-3
-37E
-5E
Units Notes
Parameter
Symbol
Min
Max
Min Max Min Max Min Max Min Max Min Max Min Max
Command
and
Address
Input setup time
tISb
125
–
175
–
175
–
200
–
200
–
250
–
350
–
ps
Input hold time
tIHb
200
–
250
–
250
–
275
–
275
–
375
–
475
–
ps
Input setup time
tISa
325
–
375
–
375
–
400
–
400
–
500
–
600
–
ps
Input hold time
tIHa
325
–
375
–
375
–
400
–
400
–
500
–
600
–
ps
Input pulse width
tIPW
0.6
–
0.6
–
0.6
–
0.6
–
0.6
–
0.6
–
0.6
–
tCK
ACTIVATE-to-
ACTIVATE delay,
same bank
tRC
54
–
55
–
55
–
54
–
55
–
55
–
55
–
ns
ACTIVATE-to-READ
or WRITE delay
tRCD
13.125
–
12.5
–
15
–
12
–
15
–
15
–
15
–
ns
ACTIVATE-to-
PRECHARGE delay
tRAS
40
70K
40
70K
40
70K
40
70K
40
70K
40
70K
40
70K
ns
PRECHARGE period
tRP
13.125
–
12.5
–
15
–
12
–
15
–
15
–
15
–
ns
PRE-
CHARGE
ALL period
<1Gb
tRPA
13.125
–
12.5
–
15
–
12
–
15
–
15
–
15
–
ns
≥1Gb
tRPA
15
–
15
–
17.5
15
18
18.75
20
ns
ACTIVATE
-to-
ACTIVATE
delay
different
bank
x4, x8
tRRD
7.5
–
7.5
–
7.5
–
7.5
–
7.5
–
7.5
–
7.5
–
ns
x16
tRRD
10
–
10
–
10
–
10
–
10
–
10
–
10
–
ns
4-bank
activate
period
(
≥1Gb)
x4, x8
tFAW
35
–
35
–
35
–
37.5
–
37.5
–
37.5
–
37.5
–
ns
x16
tFAW
45
–
45
–
45
–
50
–
50
–
50
–
50
–
ns
1Gb:
x4,
x8,
x16
DDR2
SDRAM
AC
Timing
Operating
Specifications
PDF:
09005aef821ae8bf
1GbDDR2.pdf
–
Rev.
S
10/09
EN
35
Micron
Technology,
Inc.
reserves
the
right
to
change
products
or
specifications
without
notice.
2004
Micron
Technology,
Inc.
All
rights
reserved.