参数资料
型号: MT47H128M8HQ-187ELAT:E
元件分类: DRAM
英文描述: 128M X 8 DDR DRAM, 0.35 ns, PBGA60
封装: 8 X 11.50 MM, ROHS COMPLIANT, FBGA-60
文件页数: 30/133页
文件大小: 9170K
3. Minimum CKE high time is tCKE = 3 × tCK. Minimum CKE LOW time is tCKE = 3 × tCK.
This requires a minimum of three clock cycles of registration.
4. If this command is a PRECHARGE (or if the device is already in the idle state), then the
power-down mode shown is precharge power-down, which is required prior to the
clock frequency change.
Reset
CKE Low Anytime
DDR2 SDRAM applications may go into a reset state anytime during normal operation.
If an application enters a reset condition, CKE is used to ensure the DDR2 SDRAM de-
vice resumes normal operation after reinitializing. All data will be lost during a reset
condition; however, the DDR2 SDRAM device will continue to operate properly if the
following conditions outlined in this section are satisfied.
The reset condition defined here assumes all supply voltages (VDD, VDDQ, VDDL, and
VREF) are stable and meet all DC specifications prior to, during, and after the RESET op-
eration. All other input balls of the DDR2 SDRAM device are a “Don’t Care” during
RESET with the exception of CKE.
If CKE asynchronously drops LOW during any valid operation (including a READ or
WRITE burst), the memory controller must satisfy the timing parameter tDELAY before
turning off the clocks. Stable clocks must exist at the CK, CK# inputs of the DRAM be-
fore CKE is raised HIGH, at which time the normal initialization sequence must occur
(see Initialization). The DDR2 SDRAM device is now ready for normal operation after
the initialization sequence. Figure 79 (page 126) shows the proper sequence for a RE-
SET operation.
1Gb: x4, x8, x16 DDR2 SDRAM
Reset
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. S 10/09 EN
125
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2004 Micron Technology, Inc. All rights reserved.
相关PDF资料
PDF描述
MT48LC2M32B1TG-7 2M X 32 SYNCHRONOUS DRAM, 5.5 ns, PDSO86
MT48LC32M4A2P-7ELIT:G 32M X 4 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
MT55L256L18FT-12TR 256K X 18 ZBT SRAM, 9 ns, PQFP100
MT55L256L32FT-12 256K X 32 ZBT SRAM, 9 ns, PQFP100
MT55L512V18PF-6 512K X 18 ZBT SRAM, 3.5 ns, PBGA165
相关代理商/技术参数
参数描述
MT47H128M8HQ-25AT 制造商:MICRON 制造商全称:Micron Technology 功能描述:DDR2 SDRAM
MT47H128M8HQ-25EAT 制造商:MICRON 制造商全称:Micron Technology 功能描述:DDR2 SDRAM