参数资料
型号: S29XS064R0PBHW010
厂商: SPANSION LLC
元件分类: PROM
英文描述: 4M X 16 FLASH 1.8V PROM, 80 ns, PBGA44
封装: 7.50 X 5 MM, LEAD FREE, FBGA-44
文件页数: 5/65页
文件大小: 2116K
代理商: S29XS064R0PBHW010
July 22, 2011 S29VS_XS064R_00_06
S29VS/XS-R MirrorBit
Flash Family
13
Da ta
Sh e e t
(Adv a n ce
In f o r m ation)
4.
Physical Dimensions
VDL044—44-Ball Very Thin Fine-Pitch Ball Grid Array (FBGA) 7.5 x5.0 mm Package
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1,
SPP-010 (EXCEPT AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
NOT USED.
9.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3697 \ f16-038.27 \ 6.17.8
PACKAGE
VDL 044
JEDEC
N/A
D x E
7.50 mm x 5.00 mm
NOTE
PACKAGE
SYMBOL
MIN
NOM
MAX
A
---
1.00
PROFILE
A1
0.18
---
BALL HEIGHT
A2
0.62
---
0.74
BODY THICKNESS
D
7.50 BSC
BODY SIZE
E
5.00 BSC
BODY SIZE
D1
4.50 BSC
MATRIX FOOTPRINT
E1
1.50 BSC
MATRIX FOOTPRINT
MD
10
MATRIX SIZE D DIRECTION
ME
4
MATRIX SIZE E DIRECTION
n
44
BALL COUNT
b
0.25
0.30
0.35
BALL DIAMETER
e
0.50 BSC
BALL PITCH
SE / SD
0.25 BSC
BALL PITCH
NONE
DEPOPULATED SOLDER BALLS
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