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| 型号： | W9725G6JB25I |
| 厂商： | Winbond Electronics |
| 文件页数： | 2/87页 |
| 文件大小： | 0K |
| 描述： | IC DDR2 SDRAM 256MBIT 84WBGA |
| 标准包装： | 200 |
| 格式 - 存储器： | RAM |
| 存储器类型： | DDR2 SDRAM |
| 存储容量： | 256M（16Mx16） |
| 速度： | 2.5ns |
| 接口： | 并联 |
| 电源电压： | 1.7 V ~ 1.9 V |
| 工作温度： | -40°C ~ 95°C |
| 封装/外壳： | 84-TFBGA |
| 供应商设备封装： | 84-WBGA（8x12.5） |
| 包装： | 托盘 |
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W9725G6JB
7.4.2
7.4.3
7.4.4
7.4.5
Burst mode operation ....................................................................................................... 24
Burst read mode operation ............................................................................................... 25
Burst write mode operation .............................................................................................. 25
Write data mask ............................................................................................................... 26
7.5
7.6
Burst Interrupt ..................................................................................................................................... 26
Precharge operation............................................................................................................................ 27
7.6.1
7.6.2
Burst read operation followed by precharge ..................................................................... 27
Burst write operation followed by precharge .................................................................... 27
7.7
Auto-precharge operation ................................................................................................................... 27
7.7.1
7.7.2
Burst read with Auto-precharge ....................................................................................... 28
Burst write with Auto-precharge ....................................................................................... 28
7.8
7.9
Refresh Operation ............................................................................................................................... 29
Power Down Mode .............................................................................................................................. 29
7.9.1
7.9.2
Power Down Entry ........................................................................................................... 30
Power Down Exit .............................................................................................................. 30
8.
9.
7.10
8.1
8.2
8.3
8.4
8.5
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
9.10
9.11
Input clock frequency change during precharge power down ............................................................. 30
OPERATION MODE ........................................................................................................................... 31
Command Truth Table ........................................................................................................................ 31
Clock Enable (CKE) Truth Table for Synchronous Transitions ........................................................... 32
Data Mask (DM) Truth Table ............................................................................................................... 32
Function Truth Table ........................................................................................................................... 33
Simplified Stated Diagram ................................................................................................................... 36
ELECTRICAL CHARACTERISTICS ................................................................................................... 37
Absolute Maximum Ratings ................................................................................................................ 37
Operating Temperature Condition ....................................................................................................... 37
Recommended DC Operating Conditions ........................................................................................... 38
ODT DC Electrical Characteristics ...................................................................................................... 38
Input DC Logic Level ........................................................................................................................... 38
Input AC Logic Level ........................................................................................................................... 38
Capacitance ........................................................................................................................................ 39
Leakage and Output Buffer Characteristics ........................................................................................ 39
DC Characteristics .............................................................................................................................. 40
IDD Measurement Test Parameters.................................................................................................... 42
AC Characteristics .............................................................................................................................. 43
9.11.1
9.11.2
AC Characteristics and Operating Condition for -18 speed grade ................................... 43
AC Characteristics and Operating Condition for -25/25I/25A/25K/-3 speed grade ........... 45
9.12
9.13
9.14
AC Input Test Conditions .................................................................................................................... 66
Differential Input/Output AC Logic Levels ........................................................................................... 66
AC Overshoot / Undershoot Specification ........................................................................................... 67
9.14.1
9.14.2
AC Overshoot / Undershoot Specification for Address and Control Pins: ........................ 67
AC Overshoot / Undershoot Specification for Clock, Data, Strobe and Mask pins: .......... 67
10.
10.1
TIMING WAVEFORMS ....................................................................................................................... 68
Command Input Timing ....................................................................................................................... 68
Publication Release Date: Nov. 29, 2011
-2-
Revision A02
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W9725G6KB-18 | 制造商:Winbond Electronics 功能描述:IC MEMORY 制造商:Winbond Electronics Corp 功能描述:IC MEMORY |
| W9725G6KB-25 | 功能描述:IC DDR2 SDRAM 256MBIT 84WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G（256M x 16） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6 |
| W9725G6KB-25 TR | 制造商:Winbond Electronics Corp 功能描述:256M DDR2-800, X16 |
| W9725G6KB25A | 制造商:WINBOND 制造商全称:Winbond 功能描述:DLL aligns DQ and DQS transitions with clock, Data masks (DM) for write data, Write Data Mask |
| W9725G6KB25I | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin WBGA 制造商:Winbond Electronics 功能描述:IC DDR2 SDRAM 256M 2.5NS 84WBGA 制造商:Winbond Electronics Corp 功能描述:IC DDR2 SDRAM 256M 2.5NS 84WBGA 制造商:Winbond 功能描述:DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin WBGA |
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