参数资料
型号: YF80532KC0211M
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 1500 MHz, MICROPROCESSOR, CPGA603
封装: MICRO, PGA-603
文件页数: 122/129页
文件大小: 1528K
代理商: YF80532KC0211M
92
Datasheet
Boxed Processor Specifications
7.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor passive heatsink.
Proper clearance is required around the heatsink to ensure proper installation of the processor and
unimpeded airflow for proper cooling.
7.2.1
Boxed Processor Heatsink Dimensions
The boxed processor is shipped with an unattached passive heatsink. Clearance is required around
the heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and
dimensions for the boxed Intel Xeon processor with 512KB L2 cache and assembled heatsink are
shown in Figure 44 and Figure 45. The airflow requirements for the boxed processor heatsink must
also be taken into consideration when designing new baseboards and chassis. The airflow
requirements are detailed in the Thermal Specifications, Section 7.4.
Please refer to the Intel Xeon Processor Multiprocessor (MP) Thermal Design Guidelines for
details on the processor clearance requirements.
7.2.2
Boxed Processor Heatsink Weight
The boxed processor heatsink weighs no more than 450 grams. See Section 4 and Section 5 of this
document along with the Intel Xeon Processor Multiprocessor (MP) Thermal Design
Guidelines for details on the processor weight and heatsink requirements.
7.2.3
Boxed Processor Retention Mechanism and Heatsink
Supports
The boxed processor requires a processor retention solution to secure the processor, the baseboard,
and the chassis. The retention solution contains two retention mechanisms and two retention clips
per processor. For the boxed processor, the current plan is to ship with retention mechanisms,
cooling solution retention clips, and direct chassis attach screws. Baseboards and chassis designed
for use by system integrators should include holes that are in proper alignment with each other to
support the boxed processor. Refer to the Server System Infrastructure Specification (SSI-EEB) at
http://www.ssiforum.org for details on the hole locations. Please see the <Boxed integration notes>
at http://support.intel.com/support/processors/xeon/ for retention mechanism installation
instructions. Retention mechanism clips must interface with the boxed processor heatsink area
shown in Detail A in Figure 46.
The retention mechanism that ships with the boxed Intel Xeon processor is different than the
reference solution from Intel. It adds tabs that allow the PWT (processor wind tunnel) to be
attached directly to it. Please reference Figure 45 below, which contains the dimensions for the tabs
that are different. For dimensions of the reference solution, please see the appropriate platform
design guidelines.
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