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参数资料
型号： YF80532KC0211M
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 1500 MHz, MICROPROCESSOR, CPGA603
封装： MICRO, PGA-603
文件页数： 64/129页
文件大小： 1528K
代理商： YF80532KC0211M
Contents
4
Datasheet
5
Thermal Specifications..........................................................................................69
5.1
Thermal Specifications........................................................................................ 71
5.2
Measurements for Thermal Specifications.......................................................... 73
5.2.1
Processor Case Temperature Measurement ......................................... 73
6Features .......................................................................................................................75
6.1
Power-On Configuration Options ........................................................................ 75
6.2
Clock Control and Low Power States.................................................................. 75
6.2.1
Normal State—State 1 ........................................................................... 75
6.2.2
AutoHALT Powerdown State—State 2 .................................................. 76
6.2.3
Stop-Grant State—State 3 ..................................................................... 77
6.2.4
HALT/Grant Snoop State—State 4 ........................................................ 77
6.2.5
Sleep State—State 5.............................................................................. 77
6.2.6
Bus Response during Low Power States............................................... 78
6.3
Thermal Monitor .................................................................................................. 78
6.3.1
Thermal Diode........................................................................................ 79
6.4
System Management Bus (SMBus) Interface ..................................................... 79
6.4.1
Processor Information ROM (PIROM).................................................... 80
6.4.2
Scratch EEPROM .................................................................................. 83
6.4.3
PIROM and Scratch EEPROM Supported SMBus Transactions........... 83
6.4.4
SMBus Thermal Sensor ......................................................................... 83
6.4.5
Thermal Sensor Supported SMBus Transactions .................................. 84
6.4.6
SMBus Thermal Sensor Registers......................................................... 86
6.4.6.1 Thermal Reference Registers ................................................... 86
6.4.6.2 Thermal Limit Registers ............................................................ 87
6.4.6.3 Status Register.......................................................................... 87
6.4.6.4 Configuration Register............................................................... 87
6.4.6.5 Conversion Rate Registers ....................................................... 88
6.4.7
SMBus Thermal Sensor Alert Interrupt .................................................. 88
6.4.8
SMBus Device Addressing..................................................................... 89
7
Boxed Processor Specifications .......................................................................91
7.1
Introduction ......................................................................................................... 91
7.2
Mechanical Specifications................................................................................... 92
7.2.1
Boxed Processor Heatsink Dimensions ................................................. 92
7.2.2
Boxed Processor Heatsink Weight......................................................... 92
7.2.3
Boxed Processor Retention Mechanism and Heatsink Supports........... 92
7.3
Boxed Processor Requirements ......................................................................... 95
7.3.1
Intel Xeon Processor MP on the 0.13 Micron Process
Processor ............................................................................................... 95
7.4
Thermal Specifications........................................................................................ 95
7.4.1
Boxed Processor Cooling Requirements ............................................... 95
8
Debug Tools Specifications.................................................................................97
8.1
Logic Analyzer Interface (LAI)............................................................................. 97
8.1.1
Mechanical Considerations .................................................................... 97
8.1.2
Electrical Considerations........................................................................ 97
9
Pin Listing and Signal Definitions.....................................................................99
9.1
Intel Xeon Processor MP on the 0.13 Micron Process Processor Pin
Assignments........................................................................................................ 99
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