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参数资料
型号： YF80532KC0211M
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 1500 MHz, MICROPROCESSOR, CPGA603
封装： MICRO, PGA-603
文件页数： 53/129页
文件大小： 1528K
代理商： YF80532KC0211M
Datasheet
3
Contents
1
Introduction ................................................................................................................11
1.1
Terminology.........................................................................................................13
1.1.1
Processor Packaging Terminology.........................................................13
1.2
References ..........................................................................................................14
2
Electrical Specifications........................................................................................15
2.1
System Bus and GTLREF ...................................................................................15
2.2
Power and Ground Pins ......................................................................................15
2.3
Decoupling Guidelines ........................................................................................16
2.3.1
VCC Decoupling .....................................................................................16
2.3.2
System Bus AGTL+ Decoupling.............................................................16
2.4
System Bus Clock (BCLK[1:0]) and Processor Clocking ....................................16
2.4.1
Bus Clock ..............................................................................................17
2.5
PLL Filter .............................................................................................................18
2.5.1
Mixing Processors ..................................................................................19
2.6
Voltage Identification ..........................................................................................20
2.6.1
Mixing Processors of Different Voltages ................................................21
2.7
Reserved or Unused Pins ...................................................................................22
2.8
System Bus Signal Groups .................................................................................22
2.9
Asynchronous GTL+ Signals...............................................................................24
2.10
Maximum Ratings................................................................................................24
2.11
Processor DC Specifications...............................................................................25
2.12
AGTL+ System Bus Specifications .....................................................................30
2.13
System Bus AC Specifications ............................................................................31
2.14
Processor AC Timing Waveforms .......................................................................36
3
System Bus Signal Quality Specifications ....................................................47
3.1
System Bus Clock (BCLK) Signal Quality Specifications and Measurement
Guidelines ...........................................................................................................47
3.2
System Bus Signal Quality Specifications and Measurement Guidelines...........48
3.3
System Bus Signal Quality Specifications and Measurement Guidelines...........51
3.3.1
Overshoot/Undershoot Guidelines .........................................................51
3.3.2
Overshoot/Undershoot Magnitude .........................................................52
3.3.3
Overshoot/Undershoot Pulse Duration...................................................52
3.3.4
Activity Factor.........................................................................................52
3.3.5
Reading Overshoot/Undershoot Specification Tables............................53
3.3.6
Determining if a System Meets the Overshoot/Undershoot
Specifications .........................................................................................53
4
Mechanical Specifications....................................................................................57
4.1
Mechanical Specifications ...................................................................................59
4.2
Package Load Specifications ..............................................................................64
4.3
Insertion Specifications .......................................................................................64
4.4
Mass Specifications.............................................................................................64
4.5
Materials..............................................................................................................65
4.6
Markings..............................................................................................................65
4.7
Pinout Diagram....................................................................................................66
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