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参数资料
| 型号： | YF80532KC0211M |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 1500 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | MICRO, PGA-603 |
| 文件页数： | 125/129页 |
| 文件大小： | 1528K |
| 代理商： | YF80532KC0211M |
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Datasheet
95
Boxed Processor Specifications
7.3
Boxed Processor Requirements
7.3.1
Intel Xeon Processor MP on the 0.13 Micron Process
Processor
Systems do not need to account for the processor wind tunnel or heat sink fan header in order to
support the Intel boxed processor based on the Intel Xeon processor MP on the 0.13 micron process
processor. If the system has no intention of supporting the boxed Intel Xeon processor with
512-KB L2 cache, these features may be removed. It has not yet been determined if the retention
mechanism for the Intel Xeon processor MP on the 0.13 micron process processor will ship with
the boxed processor or with the baseboards. If the retention mechanism is not included with the
boxed processor, the system integrator or baseboard supplier will have to account for these pieces.
No other special platform or system design considerations are required for integrated boxed Intel
Xeon processor MP on the 0.13 micron process processor.
7.4
Thermal Specifications
This section describes the cooling requirements of the heatsink solution utilized by the boxed
processor.
7.4.1
Boxed Processor Cooling Requirements
The boxed processor will be directly cooled with a passive heatsink. For the passive heatsink to
effectively cool the boxed processor, it is critical that sufficient, unimpeded, cool air flow over the
heatsink of every processor in the system. Meeting the processor's temperature specification is a
function of the thermal design of the entire system, and ultimately the responsibility of the system
integrator. The processor temperature specification is found in Section 5. It is important that system
integrators perform thermal tests to verify that the boxed processor is kept below its maximum
temperature specification in a specific baseboard and chassis.
At an absolute minimum, the boxed processor heatsink will require 500 Linear Feet per Minute
(LFM) of cool air flowing over the heatsink. The airflow must be directed from the outside of the
chassis directly over the processor heatsinks in a direction passing from one retention mechanism
to the other. It also should flow from the front to the back of the chassis. Directing air over the
passive heatsink of the boxed Intel Xeon processor MP on the 0.13 micron process processor can
be done with auxiliary chassis fans, fan ducts, or other techniques.
It is also recommended that the ambient air temperature outside of the chassis be kept at or below
35 °C. The air passing directly over the processor heatsink should not be preheated by other system
components (such as another processor), and should be kept at or below 45 °C. Again, meeting the
processor's temperature specification is the responsibility of the system integrator. The processor
temperature specification is found in Section 5.
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| YG101-IC1 | SINGLE COLOR LED, YELLOW GREEN, 1.2 mm |
| YG104-IC1 | SINGLE COLOR LED, YELLOW GREEN, 1.2 mm |
| YG104-ICH | SINGLE COLOR LED, YELLOW GREEN, 1.2 mm |
相关代理商/技术参数 |
参数描述 |
|---|---|
| YFA014C049ZA | 制造商:Panasonic Industrial Company 功能描述:CHASSIS |
| YFA054C022ZA | 制造商:Panasonic Industrial Company 功能描述:COVER |
| YFAW025 | 制造商:YEONHO 制造商全称:YEONHO ELECTRONICS 功能描述:Pin Header : 2.5mm PITCH |
| YFAW025-02 | 制造商:YEONHO 制造商全称:YEONHO ELECTRONICS 功能描述:Pin Header : 2.5mm PITCH |
| YFAW025-03 | 制造商:YEONHO 制造商全称:YEONHO ELECTRONICS 功能描述:Pin Header : 2.5mm PITCH |
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