参数资料
型号: YF80532KC0211M
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 1500 MHz, MICROPROCESSOR, CPGA603
封装: MICRO, PGA-603
文件页数: 96/129页
文件大小: 1528K
代理商: YF80532KC0211M
Datasheet
69
Thermal Specifications
5
This chapter provides the thermal specifications necessary for designing a thermal solution for the
Intel Xeon processor MP on the 0.13 micron process processor. The IHS provides a common
interface intended to be compatible with many heatsink designs. Thermal specifications are based
on the temperature of the IHS top, referred to as “TCASE”. Thermal solutions should be designed to
maintain the processor within its TCASE specifications. For information on performing Tcase
measurements for thermal solution design and validation, refer to the Intel Xeon Processor
(MP) Thermal Design Guidelines. See Figure 38 for an exploded view of the processor package
and thermal solution assembly. For boxed processor specifications, refer to Section 7.
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