64
Datasheet
Mechanical Specifications
4.2
Package Load Specifications
Table 30 provides dynamic and static load specifications for the Intel Xeon processor MP on the
0.13 micron process processor IHS. These mechanical load limits should not be exceeded during
heat sink assembly, mechanical stress testing, or standard drop and shipping conditions. The heat
sink attach solutions must not induce continuous stress onto the processor with the exception of a
uniform load to maintain the heat sink-to-processor thermal interface. It is not recommended to use
any portion of the processor interposer as a mechanical reference or load bearing surface for
thermal solutions.
NOTES:
1. This specification applies to a uniform compressed load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface.
3. These parameters are based on design characterization and not tested.
4. Dynamic loading specifications are defined assuming a maximum duration of 11 ms.
5. 1 lb is Heatsink weight. 50 G is shock input to the system during shock testing. AF is the amplification factor.
This is equivalent to 140 lbs.
4.3
Insertion Specifications
The Intel Xeon processor MP on the 0.13 micron process processor can be inserted and removed 15
times from a 603/604-pin socket meeting the 603-Pin Socket Design Guidelines document.
4.4
Mass Specifications
Table 31 specifies the processors mass. This includes all components which make up the entire
processor product.
Table 30. Package Dynamic and Static Load Specifications
Parameter
Max
Unit
Notes
Static
50
lbf
1, 2, 3
Dynamic
50 + 1 lb * 50G input * 1.8 (AF)
lbf
1, 2, 4,5
Table 31. Processor Mass
Processor
Mass (grams)
Intel Xeon processor MP on the 0.13 micron process processor
with 1-MB L3 cache
57
Intel Xeon processor MP on the 0.13 micron process processor
with 2-MB L3 cache
57