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参数资料
| 型号： | YF80532KC0211M |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 1500 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | MICRO, PGA-603 |
| 文件页数： | 99/129页 |
| 文件大小： | 1528K |
| 代理商： | YF80532KC0211M |
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Datasheet
71
Thermal Specifications
5.1
Thermal Specifications
Table 33 specifies the thermal design power for Intel Xeon processor MP on the 0.13 micron
process processor. The processor power listed in Table 33 is described in two ways; maximum
power and thermal design power. Analysis indicates that real applications are unlikely to cause the
processor to consume the maximum possible power. Intel recommends that system thermal be
designed to meet the Thermal Design Power (TDP) indicated in Table 33 instead of “Maximum
Processor Power.” Thermal Design Power recommendations are chosen through characterization
of server applications on the Intel Xeon processor MP on the 0.13 micron process processor.
The Thermal Monitor feature is intended to protect the processor from exceeding its thermal limit
on any high power application that exceeds the recommendations in this table. For more details on
the Thermal Monitor feature, refer to Section 6.3. For maximum upgrade flexibility, systems
should be designed to future processor power increases, even if a processor with a lower power
dissipation is planned.
In all cases, the Thermal Monitor feature must be enabled for the
processor to be operating within specification. Table 33 also lists the minimum and maximum
processor TCASE temperature specifications. A thermal solution should be designed to ensure the
temperature of the processor never exceeds these specifications.
NOTES:
1. Maximum Processor Power is the maximum thermal power that can be dissipated by the processor through
the integrated heat spreader.
2. Intel recommends that thermal solutions be designed to meet the Thermal Design Power guidelines. Refer to
the Intel Xeon Processor (MP) Thermal Design Guidelines.
3. TDP values are specified at the point on Vcc_max loadline corresponding to Icc_TDP.
4. Systems must be designed to ensure that the processor is not subjected to any static Vcc and Icc
combination wherein Vcc exceeds Vcc_max at specified Icc. Please refer to the loadline specifications in
5. Values are based on the latest silicon available at the time of publication. Any updates will be provided in a
future revision of this document.
6. Actual specifications for future processor frequencies may be different.
7. TCASE values are based on Intel reference heatsink with psi_ca of 0.33 C/W. Refer to the Intel Xeon
Processor (MP) Thermal Design Guidelines
for details.
Table 33. Intel Xeon Processor MP on the 0.13 Micron Process Processor Thermal Design
Power
Core Frequency
Maximum
Processor
Power 1 (W)
Thermal Design
Power 2
(W)
Minimum
TCASE
(°C)
Maximum
TCASE 7
(°C)
Note3, 4
Processor with 2-MB
L3 Cache
2 GHz
65
57
5
69
Processor 1-MB L3
Cache
1.50 GHz
54
48
5
67
1.90 GHz
63
55
5
68
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