参数资料
型号: LFE3-35EA-6FN484C
厂商: LATTICE SEMICONDUCTOR CORP
元件分类: FPGA
中文描述: FPGA, PBGA484
封装: 23 X 23 MM, LEAD FREE, FPBGA-484
文件页数: 70/130页
文件大小: 2667K
代理商: LFE3-35EA-6FN484C
2-41
Architecture
Lattice Semiconductor
LatticeECP3 Family Data Sheet
Figure 2-38. LatticeECP3 Banks
LatticeECP3 devices contain two types of sysI/O buffer pairs.
1.
Top (Bank 0 and Bank 1) and Bottom sysI/O Buffer Pairs (Single-Ended Outputs Only)
The sysI/O buffer pairs in the top banks of the device consist of two single-ended output drivers and two sets of
single-ended input buffers (both ratioed and referenced). One of the referenced input buffers can also be con-
figured as a differential input. Only the top edge buffers have a programmable PCI clamp.
The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive
side of the differential input buffer and the comp (complementary) pad is associated with the negative side of
the differential input buffer.
On the top and bottom sides, there is no support for programmable on-chip input termination, which is required
for DQ and DQS pins for DDR3 interface. This side is ideal for ADDR/CMD signals of DDR3, general purpose
I/O, PCI, TR-LVDS (transition reduced LVDS) or LVDS inputs. Only the top I/O banks support hot socketing
with IDK specified under the Hot Socketing Specifications. The configuration bank is not hot-socketable.
V
REF1(0)
GND
V
CCIO0
V
REF2(0)
V
REF1(1)
GND
V
CCIO1
V
REF2(1)
V
REF1(7)
GND
V
CCIO7
V
REF2(7)
VREF1(2)
GND
V
CCIO2
V REF2(2)
VREF1(3)
GND
V
CCIO3
V REF2(3)
RIGHT
Bank
2
Configuration
Bank
3
Bank
7
Bank
6
V
REF1(6)
GND
V
CCIO6
V
REF2(6)
Bank 0
Bank 1
BOTTOM
JT
A
G
Bank
SERDES
Quads
LEFT
TOP
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