参数资料
型号: LFE3-35EA-6FN484C
厂商: LATTICE SEMICONDUCTOR CORP
元件分类: FPGA
中文描述: FPGA, PBGA484
封装: 23 X 23 MM, LEAD FREE, FPBGA-484
文件页数: 81/130页
文件大小: 2667K
代理商: LFE3-35EA-6FN484C
3-2
DC and Switching Characteristics
Lattice Semiconductor
LatticeECP3 Family Data Sheet
Hot Socketing Specifications
1, 3, 4
Hot Socketing Requirements
1, 2
ESD Performance
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
IDK_HS
2
Input or I/O Leakage Current
0
V
IN VIH (Max.)
+/-1
mA
IDK
5
Input or I/O Leakage Current
0
V
IN < VCCIO
——
+/-1
mA
VCCIO VIN VCCIO + 0.5V
18
mA
1. VCC, VCCAUX and VCCIO should rise/fall monotonically.
2. Applicable to general purpose I/O pins in top I/O banks only.
3. IDK is additive to IPU, IPW or IBH.
4. LVCMOS and LVTTL only.
5. Applicable to general purpose I/O pins in left and right I/O banks only.
Description
Min.
Typ.
Max.
Units
Input current per SERDES I/O pin when device is powered down and inputs
driven.
——
8
mA
1. Assumes the device is powered down, all supplies grounded, both P and N inputs driven by CML driver with maximum allowed VCCOB
(1.575V), 8b10b data, internal AC coupling.
2. Each P and N input must have less than the specified maximum input current. For a 16-channel device, the total input current would be
8mA*16 channels *2 input pins per channel = 256mA
Pin Group
ESD Stress
Min.
Units
All pins
HBM
1000
V
All pins except high-speed serial and XRES
1
CDM
500
V
High-speed serial inputs
CDM
400
V
1. The XRES pin on the TW device passes CDM testing at 250V.
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